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PUBLICATIONS

Publications in 2009

Papers, books, talks and other publications by Hidekuni Takao in 2009.

English titles and publication details are provided for Japanese-language works. Expand “Original citation (Japanese)” to view the original reference.

Journal Articles2 entries

Journal Article 582009

"Miniaturization of Electrical Conductivity Sensors for a Multimodal Smart Microchip"

M. Futagawa, T. Iwasaki, T. Noda, H. Takao, M. Ishida, K. Sawada

Japanese Journal of Applied Physics, Vol.48, p.04C184, 2009.

Journal Article 592009

“Examination of Absorptiometry Microchip Application Aiming for Particle-Enhanced Turbidimetric Immunoassay”

T. Noda, Y. S. Shin, N. Hirokubo, K. Miyamura, K. Matsumoto, H. Takao, K. Sawada, M. Ishida

IEEJ Transactions on Sensors and Micromachines, Vol. 129, No. 8, pp. 229-233, 2009.

Peer-Reviewed International Conference Papers7 entries

Peer-Reviewed International Conference Paper 1192009

"Fabrication-modal sensor with pH, EC and temperature sensing areas for agriculture application"

M. Futagawa, T. Iwasaki, H. Takao, M. Ishida, K. Sawada

IEEE Sensors 2009 Conference, C5L-C, Christchurch, New Zealand, October, 2009.

Peer-Reviewed International Conference Paper 1202009

"Fabrication of Smart Electrochemical Sensor with CMOS Integrated Circuits"

T. Yamazaki, T. Ikeda, Y. Kano, H. Takao, M. Ishida, K. Sawada

2009 International Conference on Solid State Devices and Materials (SSDM2009), P-11-11, Sendai, Miyagi, Japan, October, 2009.

Peer-Reviewed International Conference Paper 1212009

“Three Dimensional Surface-Shape Tactile Imager with Fingertip-Size Silicon Integrated Sensor-Membrane”

H. Takao, M. Yawata, K. Sawada, M. Ishida, H. Okada

Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 2186-2189, June 21-25, Denver, Colorado, USA, 2009.

Peer-Reviewed International Conference Paper 1222009

“2-Dimensional Potassium Ion Image Sensor Aiming for Label-Free Dynamic Imaging of Living-Cell Activity”

K. Atsumi, Y. Masaki, T. Noda, T. Hattori, H. Takao, M. Ishida, K. Sawada

Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 916-919, June 21-25, Denver, Colorado, USA, 2009.

Peer-Reviewed International Conference Paper 1232009

“2-Dimentional Label-Free Acetylcholine Image Sensor For Imaging Neuronal Communication"

S. Takenaga, M. M. Rahman, H. Takao, M. Ishida, K. Sawada

Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 975-978, June 21-25, Denver, Colorado, USA, 2009.

Peer-Reviewed International Conference Paper 1242009

“Non-Linear Fluidic Integrated Circuits Realized by Pneumatic-Field Effect Transistors with Controllable Output Resistance”

H. Takao, N. Tanaka, M. Sugiura, K. Sawada, M. Ishida,

Proceedings of The 22nd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2009), pp. 503-506, Jan. 25-29, Sorrento, Italy, 2009.

Peer-Reviewed International Conference Paper 1252009

“High-Performance and Multifunctional Tactile Image Sensors Realized by Silicon CMOS/MEMS Technology”

(Invited) H. Takao and M. Ishida

Proceedings of International Conference on MEMS 2009 (ICMEMS2009), 6pages in CD-ROM, Jan. 3-5, IIT-Madras, Chennai, India, 2009.

Books1 entry

Book 62009

Sensors, Focus on Tactile, Force and Stress Sensors

H. Takao and M. Ishida (contributing authors)

Contributed section: Chapter-4: Three-Dimensional Silicon Smart Tactile Imager Using Large Deformation of Swollen Diaphragm with Integrated Piezoresistor Pixel Circuits, pp. 53-72

I-Tech Publications Co. LTD., published 2009

Original citation (Japanese)

Sensors, Focus on Tactile, Force and Stress Sensors

H. Takao and M. Ishida(分担執筆)

担当箇所:Chapter-4: Three-Dimensional Silicon Smart Tactile Imager Using Large Deformation of Swollen Diaphragm with Integrated Piezoresistor Pixel Circuits, pp. 53-72

I-Tech Publications Co. LTD., 2009年出版

Invited Talks (International)2 entries

Invited Talk (International) 252009

“CMOS-MEMS Integration Technologies and Smart-Microsensors”

H. Takao

Japan-Taiwan CMOS MEMS Workshop 2009, Tsing Hua University, Hsinchu, Taiwan, Mar. 2009.

Invited Talk (International) 262009

“High-Performance and Multifunctional Tactile Image Sensors Realized by Silicon CMOS/MEMS Integration Technology”

H. Takao and M. Ishida

International Conference on MEMS (ICMEMS 2009), 6pages in CD-ROM, IIT-Madras, Chennai, India, Jan. 2009.

Invited Talks (Domestic)4 entries

Invited Talk (Domestic) 512009

“Integration of LSI and MEMS Sensors: Technologies and Prospects”

Hidekuni Takao

2009 IEICE Society Conference, Tutorial Session on MEMS-Integrated LSI Technology for More than Moore, Niigata University, Sep. 2009

Original citation (Japanese)

“LSIとMEMSセンサの集積化技術と展望”

高尾 英邦

平成21年電子情報通信学会ソサイエティー大会チュートリアルセッション「More than Mooreを実現するMEMS融合LSI技術」,新潟大学,2009年9月

Invited Talk (Domestic) 522009

“Integrating MEMS, Sensors, and Integrated Circuits”

高尾 英邦,石田 誠

56th JSAP Spring Meeting, Symposium on Advanced Developments in Integrated MEMS Technology Toward Commercialization, University of Tsukuba, Mar. 2009

Original citation (Japanese)

“MEMS・センサと集積回路の統合化技術”

高尾 英邦,石田 誠

第56回応用物理学関係連合講演会シンポジウム「産業化に向かう集積化MEMS技術の先端開発動向」, 筑波大学,2009年3月

Invited Talk (Domestic) 532009

“Distributed Smart Sensors Enabled by Functional Integration”

高尾 英邦,澤田 和明,石田 誠

Symposium at the 2009 IEEJ National Convention, Hokkaido University, Mar. 2009

Original citation (Japanese)

“機能集積化で実現する分散型スマートセンサ”

高尾 英邦,澤田 和明,石田 誠

平成21年電気学会全国大会シンポジウム,北海道大学,2009年3月

Invited Talk (Domestic) 542009

“Intelligent Sensor Technology and Its Future”

Hidekuni Takao

292nd Meeting of the Higashi-Mikawa Industry–Academia Exchange Salon, Hotel Arc Riche Toyohashi, Feb. 2009

Original citation (Japanese)

“インテリジェントセンサ技術と未来像”

高尾 英邦

東三河産学交流サロン第292回例会,ホテルアークリッシュ豊橋,2009年2月