"Miniaturization of Electrical Conductivity Sensors for a Multimodal Smart Microchip"
Japanese Journal of Applied Physics, Vol.48, p.04C184, 2009.
PUBLICATIONS
Papers, books, talks and other publications by Hidekuni Takao in 2009.
English titles and publication details are provided for Japanese-language works. Expand “Original citation (Japanese)” to view the original reference.
Japanese Journal of Applied Physics, Vol.48, p.04C184, 2009.
IEEJ Transactions on Sensors and Micromachines, Vol. 129, No. 8, pp. 229-233, 2009.
IEEE Sensors 2009 Conference, C5L-C, Christchurch, New Zealand, October, 2009.
2009 International Conference on Solid State Devices and Materials (SSDM2009), P-11-11, Sendai, Miyagi, Japan, October, 2009.
Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 2186-2189, June 21-25, Denver, Colorado, USA, 2009.
Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 916-919, June 21-25, Denver, Colorado, USA, 2009.
Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 975-978, June 21-25, Denver, Colorado, USA, 2009.
Proceedings of The 22nd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2009), pp. 503-506, Jan. 25-29, Sorrento, Italy, 2009.
Proceedings of International Conference on MEMS 2009 (ICMEMS2009), 6pages in CD-ROM, Jan. 3-5, IIT-Madras, Chennai, India, 2009.
Contributed section: Chapter-4: Three-Dimensional Silicon Smart Tactile Imager Using Large Deformation of Swollen Diaphragm with Integrated Piezoresistor Pixel Circuits, pp. 53-72
I-Tech Publications Co. LTD., published 2009
Sensors, Focus on Tactile, Force and Stress Sensors
H. Takao and M. Ishida(分担執筆)
担当箇所:Chapter-4: Three-Dimensional Silicon Smart Tactile Imager Using Large Deformation of Swollen Diaphragm with Integrated Piezoresistor Pixel Circuits, pp. 53-72
I-Tech Publications Co. LTD., 2009年出版
Japan-Taiwan CMOS MEMS Workshop 2009, Tsing Hua University, Hsinchu, Taiwan, Mar. 2009.
International Conference on MEMS (ICMEMS 2009), 6pages in CD-ROM, IIT-Madras, Chennai, India, Jan. 2009.
2009 IEICE Society Conference, Tutorial Session on MEMS-Integrated LSI Technology for More than Moore, Niigata University, Sep. 2009
“LSIとMEMSセンサの集積化技術と展望”
高尾 英邦
平成21年電子情報通信学会ソサイエティー大会チュートリアルセッション「More than Mooreを実現するMEMS融合LSI技術」,新潟大学,2009年9月
56th JSAP Spring Meeting, Symposium on Advanced Developments in Integrated MEMS Technology Toward Commercialization, University of Tsukuba, Mar. 2009
“MEMS・センサと集積回路の統合化技術”
高尾 英邦,石田 誠
第56回応用物理学関係連合講演会シンポジウム「産業化に向かう集積化MEMS技術の先端開発動向」, 筑波大学,2009年3月
Symposium at the 2009 IEEJ National Convention, Hokkaido University, Mar. 2009
“機能集積化で実現する分散型スマートセンサ”
高尾 英邦,澤田 和明,石田 誠
平成21年電気学会全国大会シンポジウム,北海道大学,2009年3月
292nd Meeting of the Higashi-Mikawa Industry–Academia Exchange Salon, Hotel Arc Riche Toyohashi, Feb. 2009
“インテリジェントセンサ技術と未来像”
高尾 英邦
東三河産学交流サロン第292回例会,ホテルアークリッシュ豊橋,2009年2月