"Miniaturization of Electrical Conductivity Sensors for a Multimodal Smart Microchip"
Japanese Journal of Applied Physics, Vol.48, p.04C184, 2009.
PUBLICATIONS
高尾英邦の2009年の論文・著書・講演等を掲載しています。
Japanese Journal of Applied Physics, Vol.48, p.04C184, 2009.
IEEJ Transactions on Sensors and Micromachines, Vol. 129, No. 8, pp. 229-233, 2009.
IEEE Sensors 2009 Conference, C5L-C, Christchurch, New Zealand, October, 2009.
2009 International Conference on Solid State Devices and Materials (SSDM2009), P-11-11, Sendai, Miyagi, Japan, October, 2009.
Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 2186-2189, June 21-25, Denver, Colorado, USA, 2009.
Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 916-919, June 21-25, Denver, Colorado, USA, 2009.
Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 975-978, June 21-25, Denver, Colorado, USA, 2009.
Proceedings of The 22nd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2009), pp. 503-506, Jan. 25-29, Sorrento, Italy, 2009.
Proceedings of International Conference on MEMS 2009 (ICMEMS2009), 6pages in CD-ROM, Jan. 3-5, IIT-Madras, Chennai, India, 2009.
担当箇所:Chapter-4: Three-Dimensional Silicon Smart Tactile Imager Using Large Deformation of Swollen Diaphragm with Integrated Piezoresistor Pixel Circuits, pp. 53-72
I-Tech Publications Co. LTD., 2009年出版
Japan-Taiwan CMOS MEMS Workshop 2009, Tsing Hua University, Hsinchu, Taiwan, Mar. 2009.
International Conference on MEMS (ICMEMS 2009), 6pages in CD-ROM, IIT-Madras, Chennai, India, Jan. 2009.
平成21年電子情報通信学会ソサイエティー大会チュートリアルセッション「More than Mooreを実現するMEMS融合LSI技術」,新潟大学,2009年9月
第56回応用物理学関係連合講演会シンポジウム「産業化に向かう集積化MEMS技術の先端開発動向」, 筑波大学,2009年3月
平成21年電気学会全国大会シンポジウム,北海道大学,2009年3月
東三河産学交流サロン第292回例会,ホテルアークリッシュ豊橋,2009年2月