“Compartmentalization Device of Microenvironment for Analyzing iPSCs Differentiation”
Electrical Engineering in Japan, Vol. 218, No. 1, Issue e23503, DOI: 10.1002/eej.23503, Mar. 2025.
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Journal Articles123 entries
"Development of A Relaxation Effect Evaluation System by Measuring Human Skin Comfort"
International Journal of Nursing and Health Care Research, Vol. 6, No. 12, pp. 1-9, DOI: 10.29011/2688-9501.101491, Dec. 2023.
"Neural Network-based Tactile Perception System Using Ultra-high Resolution Tactile Sensor"
IEEE Transactions on Haptics, Vol. 16, No. 4, pp. 504-510, Apr. 2023.
"Microfluidic device for differentiation induction of iPS cells-derived embryoid bodies with local chemical stimulation"
Electronics and Communications in Japan, Vol. 142, No. 12, pp. 310-315, Feb. 2023.
“Optically driven microtools with an antibody‐immobilised surface for on‐site cell assembly”
IET Nanobiotechnology, Vol. 17, No. 3, pp. 197-203, DOI: 10.1049/nbt2.12114, Jan. 2023.
“Stabilization of NPPV Mask Fitting using Fine Adjusting Mechanism of Strap Tension”
IEEJ Transactions on Electronics, Information and Systems, Vol. 142, No. 10, pp. 1099-1106, Oct. 2022.
Original citation (Japanese)
“ストラップ張力の微調整機構によるNPPV マスクフィッティングの安定化”
淺原 佳江, 高尾 英邦
電気学会論文誌 C（電子・情報・システム部門誌）, Vol. 142, No. 10, pp. 1099-1106, Oct. 2022.
"Pen-type pulse wave measurement system for detecting pathological changes in cardiac diseases"
IEEJ Transactions on Sensors and Micromachines, Vol. 142, No.7, pp. 160-165, Jul. 2022.
(An English translation was published in the Wiley journal listed below.)
K. Yamada, K. Watatani, K. Terao, F. Shimokawa, H. Takao
"Pen-type pulse wave measurement system for detecting pathological changes in cardiac diseases"
Electronics and Communications in Japan, Vol. 142, No. 7, pp. 160-165, Sep. 2022.
Original citation (Japanese)
“心疾患等における病理学的変化を捉えるペン型脈波計測システム”
山田 康誠, 綿谷 一輝, 寺尾 京平, 下川 房男, 高尾 英邦
電気学会論文誌Ｅ（センサ・マイクロマシン部門誌）, Vol. 142, No.7, pp. 160-165, Jul. 2022.
（英訳論文として下記Wiley誌に掲載）
K. Yamada, K. Watatani, K. Terao, F. Shimokawa, H. Takao
"Pen-type pulse wave measurement system for detecting pathological changes in cardiac diseases"
Electronics and Communications in Japan, Vol. 142, No. 7, pp. 160-165, Sep. 2022.
“A Fully Wireless Structural-Color Sensor for Endoscopic Applications”
Medical Science Digest, Vol.48, No.3, pp. 46-49, Feb. 2022.
Original citation (Japanese)
“内視鏡環境における構造色式完全無線センサ”
前田 祐作, 宅和 宏樹, 中川 智明, 森 宏仁, 高尾 英邦
Medical Science Digest, Vol.48, No.3, pp. 46-49, Feb. 2022.
“On-demand formation of heterogeneous gel fibers using two-dimensional micronozzle array”
Microfluidics and Nanofluidics, Vol. 26, No. 2, Article15, DOI: 10.1007/s10404-022-02525-3, Jan. 2022.
"Highly sensitive flexible strain and temperature sensors using solution processed graphene palladium nanocomposite"
Sensors and Actuators A: Physical, Vol. 334, pp. 113314-113314, Feb. 2022.
"Flexible Strain Sensor with High Sensitivity, Fast Response, and Good Sensing Range for Wearable Applications"
Nanotechnology, Vol. 32, No. 50, pp. 505506-1~8, Oct. 2021.
“Quantitative Evaluation Method of NPPV Mask Fitting by the Application of Strap Load Measurement Technology”
IEEJ Transactions on Sensors and Micromachines, Vol. 141, No. 9, pp. 312-320, Sep. 2021.
Original citation (Japanese)
“ストラップ荷重の計測技術を応用したNPPVマスクフィッティングの定量的評価法”
淺原 佳江, 高尾 英邦
電気学会論文誌 E（センサ・マイクロマシン部門誌）, 141巻, 9号, pp. 312-320, Sep. 2021.
“Development of optical-driven nanoneedles using SU-8 nanofabrication”
IEEJ Transactions on Sensors and Micromachines, Vol. 141, No. 6, pp. 173-178, Jun. 2021.
(An English translation was published in the Wiley journal listed below.)
M. Harada, H. Takao, F. Simokawa, K. Terao
“Development of optical-driven nanoneedles using SU-8 nanofabrication”
Electronics and Communications in Japan, Vol. 105, No. 1, paper ID: e12327, Mar. 2022.
Original citation (Japanese)
「SU-8ナノ加工を用いた光操作型ナノニードルの開発」
原田 雅彦, 高尾 英邦, 下川 房男, 寺尾 京平
電気学会論文誌Ｅ（センサ・マイクロマシン部門誌）, Vol. 141, No. 6, pp. 173-178, Jun. 2021.
（英訳論文として下記Wiley誌に掲載）
M. Harada, H. Takao, F. Simokawa, K. Terao
“Development of optical-driven nanoneedles using SU-8 nanofabrication”
Electronics and Communications in Japan, Vol. 105, No. 1, paper ID: e12327, Mar. 2022.
“On-site processing of single chromosomal DNA molecules using optically driven microtools on a microfluidic workbench”
Scientific Reports, Vol. 11, No. 1, pp.7961-7961, Apr. 2021.
“Stainless microfluidic probe with 2D-array microapertures”
AIP Advances, Vol. 11, No. 1, pp. 15331, DOI: 10.1063/5.0014119, Jan. 2021.
"Capture and elongation of single chromosomal DNA molecules using optically-driven microchopsticks"
Biomicrofluidics, Vol. 14, No. 4, 044114, Aug. 2020.
“Post-CMOS Compatible Silicon MEMS Nano-Tactile Sensor for Touch Feeling Discrimination of Materials”
The Electrochemical Society Transactions, Vol. 97, No. 5, pp. 79-80, 2020.
Original citation (Japanese)
“Post-CMOS Compatible Silicon MEMS Nano-Tactile Sensor for Touch Feeling Discrimination of Materials”
H. Takao (招待論文)
The Electrochemical Society Transactions, Vol. 97, No. 5, pp. 79-80, 2020.
“A MEMS Tactile Sensor with Fingerprint-Like Array of Contactors for High Resolution Visualization of Surface Distribution of Tactile Information”
Journal of Robotics and Mechatronics, Vol. 32, No. 2, pp. 305-314, 2020.
“Planar-type MEMS tactile sensor integrating micro-macro detection function of fingertip to evaluate surface touch sensation”
Japanese Journal of Applied Physics, Vol. 58, No. 9, pp. 097002-1-9, DOI 10.7567/1347-4065/ab3903, 2019.
“A highly sensitive MEMS silicon-hair device reproducing the function of hair follicle”
IEEJ Transactions on Sensors and Micromachines, Vol. 139, No. 7, pp. 180-185, 2019.
(An English translation was published in the Wiley journal listed below.)
K. Hamamoto, K. Terao, F. Shimokawa, H. Takao
“A highly sensitive MEMS silicon-hair device reproducing the function of hair follicle”
Electronics Communication in Japan, Vol. 102, No. 10, pp. 50-56, 2019.
Original citation (Japanese)
“毛包細胞の機能を模した高感度MEMSシリコン毛デバイス”
濱本晃輝, 寺尾京平, 下川房男, 高尾英邦
電気学会論文誌E, Vol. 139, No. 7, pp. 180-185, 2019.
（英訳論文として下記Wiley誌に掲載）
K. Hamamoto, K. Terao, F. Shimokawa, H. Takao
“A highly sensitive MEMS silicon-hair device reproducing the function of hair follicle”
Electronics Communication in Japan, Vol. 102, No. 10, pp. 50-56, 2019.
“Highly sensitive, scalable reduced graphene oxide with palladium nano-composite as strain sensor”
Nanotechnology, Vol. 31, No. 3, 035501, 2019.
“Phloem-sap-dynamics sensor device for monitoring photosynthates transportation in plant shoots”
Japanese Journal of Applied Physics, Vo. 57, No. 6, 067001, DOI: 10.7567/JJAP.57.067001, 2018.
“Fully wireless pressure sensor based on endoscopy images”
Japanese Journal of Applied Physics, Vol. 57, No. 4S, 04FC05, DOI 10.7567/JJAP.57.04FC05, 2018.
“Pure Photosynthates Extraction Sensor Device with Highly Precise Phloem/Xylem Position Identification”
IEEE Sensors Journal, Vol. 18, No. 4, pp.1739-1746, 2018.
(Invited Paper) “Cell-like Sensor” Devices Directed to Ultra Low Invasive Implementation
IEICE Transactions on Electronics, Vol. J101-C, No. 1, pp. 9-17, 2018.
Original citation (Japanese)
“（招待論文）超低侵襲実装を志向する「細胞化センサ」デバイス”
高尾 英邦, 森 宏仁, 前田 祐作, 綿谷 一輝, 寺尾 京平, 下川房男, 前田 光平, 香西 亮吾
電子情報通信学会論文誌C, Vol. J101-C, No. 1, pp. 9-17, 2018.
“Evaluation of Multi-Electrode Effects on Electrovibration Tactile Stimulation”
Transactions of The Japan Institute of Electronics Packaging, Vol. 10, pp. E17-004-1-E17-004-8, 2017.
“Development of Microfluidic Device for Imaging Paracrine Communication”
IEEJ Transactions on Sensors and Micromachines, Vol. 137, No. 5, pp. 128-133, May 2017.
Original citation (Japanese)
“液性細胞間相互作用観察に向けたマイクロ流体デバイスの開発”
田尾 祐一, 福田健太, 高尾英邦, 下川房男, 寺尾京平
電気学会論文誌 E（センサ・マイクロマシン部門誌）, Vol. 137, No. 5, pp. 128-133, May 2017.
“Integrated pressure and temperature sensor with high immunity against external disturbance for flexible endoscope operation”
Japanese Journal of Applied Physics, Vol. 56, No. 4S, pp. 04CF09-1~6, 2017.
“An Ultraminiature Xylem Sap Flow Sensor Using MEMS Technology”
Japanese Journal of Ecology, Vol. 66, No. 2, pp. 465-475, DOI: 10.18960/seitai.66.2_465, Aug. 2016.
Original citation (Japanese)
“MEMS 技術を用いた超小型道管流センサ”
越智誠，矢野裕也，寺尾京平，鈴木孝明，高尾英邦，小林 剛，片岡郁雄，下川房男
日本生態学会誌, Vol. 66, No. 2, pp. 465-475, DOI: 10.18960/seitai.66.2_465, Aug. 2016.
“Development of a local light stimulation device integrated with micro electrode array”
Mechanical Engineering Journal, Vol. 3, No. 4, DOI: 10.1299/mej.15-00570, 2016.
“Development of a two-dimensional scanning micro-mirror utilizing magnetic polymer composite”
Japanese Journal of Applied Physics, Vol. 55, No. 6, pp. 06GP01, DOI 10.7567/JJAP.55.06GP01, 2016.
“Characterisation of optically driven microstructures for manipulating single DNA molecules under a fluorescence microscope”
IET Nanobiotechnology, Vol. 10, No. 3, pp. 124-128, 2016.
“A MEMS hardness sensor with reduced contact force dependence based on the reference plane concept aimed for medical applications”
Japanese Journal of Applied Physics, Vol. 55, No. 4, pp. 04EF11-1-04EF11-6, 2016.
“Development of magnetically driven microvalve using photosensitive SU-8/Fe composite”
International Journal of Applied Electromagnetics and Mechanics, Vol. 52, No.3-4, pp. 1585-1590, 2016.
“Development of magnetically driven micro valve using SU-8/Fe composite”
Journal of the Japan Society of Applied Electromagnetics and Mechanics, Vol. 23, pp. 2, pp. 407-413, 2015.
Original citation (Japanese)
“SU-8/Feコンポジットを用いた磁気駆動型マイクロバルブの開発”
鈴木淳也, 寺尾京平, 高尾英邦, 下川房男, 大平文和, 鈴木孝明
日本AEM学会誌, Vol. 23, pp. 2, pp. 407-413, 2015.
“Fast protein detection in raw blood by size-exclusion SPR sensing”
Analytical Methods, Vol. 7, No. 16, pp. 6483-6488, 2015.
“Precise tumor size measurement under constant pressure by novel real-time micro-electro-mechanical-system hood for proper treatment (with videos)”
Surgical Endoscopy and Other Intervantional Techniques, Vol. 29, No. 1, pp. 212-219, 2015.
“Development of an Electromagnetic Micropump Using a Photosensitive Magnetic Nanocomposite”
Journal of the Japan Society of Applied Electromagnetics and Mechanics, Vol. 22, No. 2, pp. 202-207, 2014.
Original citation (Japanese)
“感光性磁気ナノ複合材料を用いた電磁マイクロポンプの開発”
植田勇作, 中原佐, 寺尾京平, 高尾英邦, 下川房男, 大平文和, 小寺秀俊, 鈴木孝明
日本AEM学会誌，Vol. 22，No. 2，pp. 202-207，2014.
“Application of Silicon on Nothing Structure for Developing a Novel Capacitive Absolute Pressure Sensor”
IEEE Sensors Journal, Vol. 14, No. 3, pp. 808-815, 2014.
“An analytical thermal-structural model of a gas-sealed capacitive pressure sensor with a mechanical temperature compensation structure”
Sensors and Actuators A Physical, Vol. 205, pp. 92-102, 2014.
“A Post-Complementary Metal Oxide Semiconductor Formation Process of High-Adhesiveness SU-8 Structures for Reliable Fabrication of Integrated Microelectromechanical System Sensors”
Japanese Journal of Applied Physics, Vol. 52, Issue 6, pp. 06GL18-06GL18-5, 2013.
“Miniature Optical Multi-Gas Sensors Using Micromachining Technology [II]: Characteristics of Raman-Scattering and Ultraviolet-Absorption Gas Sensors”
IEEJ Transactions on Sensors and Micromachines, Vol. 133, No. 9, pp. 260-266, 2013.
Original citation (Japanese)
“マイクロマシン技術を用いた小型光学式マルチガスセンサ［II］ －ラマン散乱型と紫外吸収分光型ガスセンサの特性－”
朝日一平, 杉本幸代, 二宮英樹, 下川房男, 高尾英邦, 大平文和, 筒井靖之, 林宏樹, 今野隆
電気学会論文誌E センサ・マイクロマシン部門誌, Vol. 133, No. 9, pp. 260-266, 2013.
“Miniature Optical Multi-Gas Sensors Using Micromachining Technology [1]: Fabrication of a Precision Micro-Optical Bench Using Ultrathick Polymer Films”
IEEJ Transactions on Sensors and Micromachines, Vol. 133, No. 6, pp. 237-242, 2013.
Original citation (Japanese)
“マイクロマシン技術を用いた小型光学式マルチガスセンサ［1］ -超厚膜樹脂を用いた高精度なマイクロ光学ベンチの製作-”
伊藤将寛, 武田知也, 鈴木孝明, 高尾英邦, 大平文和, 下川房男, 筒井靖之, 林宏樹, 今野隆, 朝日一平, 杉本幸代, 二宮英樹
電気学会論文誌E センサ・マイクロマシン部門誌, Vol. 133, No. 6, pp. 237-242, 2013.
“Development of a High-Speed DNA Fiber Analysis Device Using MEMS Technology”
IEEJ Transactions on Sensors and Micromachines, Vol. 133, No. 5, pp. 139-146, 2013.
Original citation (Japanese)
“MEMS技術を利用した高速DNAファイバ解析デバイスの開発”
鈴木孝明, 寺尾京平, 鈴木博之, 新田祐幹, 高尾英邦, 下川房男, 大平文和, 平丸大介, 小寺秀俊
電気学会論文誌E センサ・マイクロマシン部門誌, Vol. 133, No. 5, pp. 139-146, 2013.
“Development of a Precision Thick-Film Spray-Coating Method Using Multiple Coating Layers”
IEEJ Transactions on Sensors and Micromachines, Vol. 133, No. 5, pp. 170-176, 2013.
Original citation (Japanese)
“多層塗布による高精度厚膜スプレーコート法の開発”
赤松幹夫, 寺尾京平, 高尾英邦, 下川房男, 大平文和, 鈴木孝明
電気学会論文誌E センサ・マイクロマシン部門誌, Vol. 133, No. 5, pp. 170-176, 2013.
“Signal Enhancement of Protein Binding by Electrodeposited Gold Nanostructures for Application in Kretschmann-Type SPR Sensor”
Analyst, Vol. 137, No.21, pp. 5034-5040, Sept. 2012.
“CMOS RF Transmitter Using Pulsewidth Modulation for Wireless Smart Sensors”
IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 9, pp. 1501-1509, 2012.
“Development of a Biocompatible Flexible Strain Sensor”
IEEJ Transactions on Sensors and Micromachines, Vol. 132, No. 9, pp. 318-319, 2012.
Original citation (Japanese)
“生体適合性を有するフレキシブルひずみセンサの開発”
濱田浩幸, 神田健介, 高尾英邦, 藤田孝之, 樋口行平, 前中一介
電気学会論文誌E センサ・マイクロマシン部門誌, Vol. 132, No. 9, pp. 318-319, 2012.
“An Annular Mechanical Temperature Compensation Structure for Gas-Sealed Capacitive Pressure Sensor”
Sensors, Vol. 12, No. 6, pp. 8026-8038, 2012.
“Vertical Comb-Drive MEMS Mirror with Sensing Function for Phase-Shift Device”
Sensors and Actuators A Physical, Vol. 181, pp. 61-69, 2012.
“Size-Exclusion SPR Sensor Chip: Application to Detection of Aggregation and Disaggregation of Biological Particles”
Analyst, Vol. 137, No.9, pp. 2192-2198, May 2012.
“Evaluation of Electrodeposited Gold Nanostructures for Applications in QCM Sensing”
Analytical Sciences, Vol. 28, No. 3, pp. 291-294, March 2012.
“Cell culture on MEMS materials in microenvironment limited by a physical condition”
Micro and Nano Letters, Vol. 7, No. 8, pp. 725-728, Feb. 2012.
"Oscillation-controlled CMOS ring oscillator for wireless sensor systems,"
Microelectronics journal, Vol. 41, pp. 815-819, 2010.
“Design and fabrication of complementary metal-oxide-semiconductor sensor chip for electrochemical measurement”
Japanese Journal of Applied Physics, Vol. 49, No. 4-2, pp. 04DL11(7pages), DOI:10.1143/JJAP.49.04DL11, 2010.
“A Versatile Integration Technology of SOI-MEMS/CMOS Devices Using Microbridge Interconnection Structures”
ASME/IEEE Journal of Microelectromechanical Systems, Vol. 19, No. 4, pp. 919-926, 2010.
“A Multifunctional Integrated Silicon Tactile Imager with Arrays of Strain and Temperature Sensors on Single Crystal Silicon Diaphragm”
Sensors and Actuators A Physical, Vol. 160, pp. 69-77, 2010.
"Miniaturization of Electrical Conductivity Sensors for a Multimodal Smart Microchip"
Japanese Journal of Applied Physics, Vol.48, p.04C184, 2009.
“Examination of Absorptiometry Microchip Application Aiming for Particle-Enhanced Turbidimetric Immunoassay”
IEEJ Transactions on Sensors and Micromachines, Vol. 129, No. 8, pp. 229-233, 2009.
“Development of a disposable glucose biosensor using electroless-plated Au/Ni/copper low electrical resistance electrodes”
Biosensors and Bioelectronics, Vol. 24, pp. 410-414, 2008.
“An enhanced glucose biosensor using charge transfer techniques”
Biosensors and Bioelectronics, Vol. 24, pp. 650-656, 2008.
“A Novel RF Induced Power Supply System for Monolithically Integrated Ubiquitous Micro Sensor Nodes”
Sensors and Actuators A: Physical, Vol. 145-146, pp. 343-348, 2008.
“Low-Noise Fully Differential Amplifiers Using JFET-CMOS Integration Technology for Smart Sensors”
IEEJ Transactions on Electrical and Electronic Engineering, Vol. 3, pp. 274-280, 2008.
“Integration of Out-of-Plane Silicon Dioxide Microtubes, Silicon Microprobes and on-chip NMOSFETS by Selective Vapor-Liquid-Solid Growth”
Journal of Micromechanics and Microengineering, Vol. 18, No. 035033, pp. 1-9, 2008.
“A Wide Dynamic Range Photogate-Type Active Pixel Sensor Using a Self-Regulation Principle”
Japanese Journal of Applied Physics, Vol. 47, No. 1, pp. 173-178, 2008.
“Neo-Transmitter Using Pulse Width Modulation (PWM) Method for Wireless Smart Sensors”
IEEJ Transactions on Sensors and Micromachines, Vol. 128, No. 1, 2008.
“Fabrication of a Pressure Difference Type Gas Flow Sensor using ICP-RIE Technology”
Journal of the Semiconductor & Display Technology, Vol. 7, No. 1, pp. 1-5, 2008.
“Fabrication of Thermoelectric Sensor Using Silicon-on-Insulator Structure”
Japanese Journal of Applied Physics, Vol. 46, No. 11, pp. 7232-7236, 2007.
“Effect of High Drain Voltage on Stress Sensitivity in nMOSFETs”
Sensors and Actuators A: Physical, Vol. 140, pp.89-93, 2007.
“Wafer-level integration technique of surface mount devices on a Si-wafer with vibration energy and gravity force”
IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 3, pp. 457-463, Sept. 2007.
“Smart Microfluidic Electrochemical DNA Sensors with Signal Processing Circuits”
Japanese Journal of Applied Physics, Vol. 46, No. 5A, pp. 3135-3138, 2007.
“Development of radio frequency transmitters including on-chip antenna for intelligent human sensing systems”
IEEJ Transactions on Electrical and Electronic Engineering, Vol. 2, No. 3, pp. 365-371, 2007.
“Pneumatic MEMS In-Channel Microvalves with In-Plane Control Ports for Micro Fluidic Systems Integrated on a Chip Surface”
Sensors and Materials, Vol. 19, No. 1, pp. 19-34, 2007.
“Fabrication of a silicon pressure sensor for measuring low pressure using ICP-RIE”
Journal of Sensor Science and Technology, Vol. 16, No. 2, pp. 126-131, 2007.
“Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems”
Sensors, Vol. 7, No. 8, pp. 1387-1398, Jul. 2007.
“32 x 32 SOI CMOS image sensor with pinned photodiode on handle wafer”
Optical Review, Vol. 14, No. 3, pp.125-130, May 2007.
“High speed SOI CMOS image sensor with pinned photodiode on handle wafer”
Microelectronics Journal, Vol. 38, No. 1, pp. 102-107, Jan. 2007.
“Characteristics of Highly Sensitive pH Sensors with Charge Accumulation Operation”
Japanese Journal of Applied Physics, Vol. 45, No. 12, pp. 9259-9263, 2006.
“Performance of Absorption Photometry Microchip for Blood Hemoglobin Measurement Integrated with Processing Circuits and Si (110) 45º-Mirrors”
Sensors and Actuators B: Chemical, Vol.119, pp.245-250, 2006.
“Low voltage SOI CMOS image sensor with pinned photodiode on handle wafer”
International Journal of Modern Physics B, Vol. 20, No. 25-27, pp. 4207-4212, 2006.
“Fabrication of a two-dimensional pH image sensor using a charge transfer technique”
Sensors and Actuators B: Chemical Volume 117, pp. 509-515, 2006.
“Monolithic Silicon Smart Tactile Image Sensor with Integrated Strain Sensor Array on Pneumatically Swollen Single Diaphragm Structure”
IEEE Transactions on Electron Devices, Vol. 53, No. 5, pp. 1250-1259, May 2006.
“The fabrication of filter-less fluorescence detection sensor array using CMOS image Sensor technique”
Sensors and Actuators A: Physical, Vol. 128, pp. 66-70, 2006.
“Improvement of MOS Interface Characteristics in CMOS on Si(111) by Combination of Fluorine Implantation and Long-Time Hydrogen Annealing”
Japanese Journal of Applied Physics, Part 2 Letter, Vol. 45, No. 04, pp. L108-L110, 2006.
“Fabrication of ultrasonic transducers using epitaxial Pb(Zr,Ti)O3 thin films on epitaxial γ-Al2O3/Si substrates for smart sensors”
Sensors and Materials, Vol. 18, No. 3, pp. 161-169, 2006.
“A Novel Filterless Fluorescence Detection Sensor for DNA Analysis”
IEEE Transactions on Electron Devices, Vol. 53, No. 3, pp. 553-558, March 2006.
“Fabrication of a High-Temperature Silicon Pressure Sensor Using SDB-SOI Technology”
Sensors and Materials, Vol. 17, No. 5, pp. 269-276, 2005.
“A novel fused sensor for photo- and ion-sensing”
Sensors and Actuators B: Chemical, Vol. 106, pp. 614-618, 2005.
“MEMS based high dose radiation resistant SOI pressure sensor for aerospace applications”
Sensors and Materials, Vol. 17, No. 5, pp. 237-247, 2005.
“Realization of In Situ Doped n-Type and p-Type Si-Microprobe Array by Selective Vapor-Liquid-Solid (VLS) Growth Method”
Japanese Journal of Applied Physics, Vol. 44, No. 4B, pp. 2161-2165, 2005.
“A MEMS Microvalve with PDMS Diaphragm and Two Chamber Configuration of Thermo-Pneumatic Actuator for Integrated Blood Test System on Silicon”
Sensors and Actuators A: Physical, Vol. 119, pp. 468-475, 2005.
“The Characteristic Improvement of Si (111) MOSFET by Long-Time Hydrogen Annealing”
Japanese Journal of Applied Physics, Vol. 43, No. 10, pp. 6848-6853, 2004.
“Fabrication of JFET Device on Si (111) for Sensor Interface Array Circuit”
IEICE Electronics Express, Vol. 1, No. 9, pp. 243-247, 2004.
“Electron Emission Characteristics from a Single Crystalline Ferroelectric Material by an Infrared Light Irradiation”
Journal of Vacuum Science & Technology B, Vol. 22, No. 3, pp. 1396-1401, 2004.
“SOI-CMOS Precision Front-End Amplifier for Wide Range and High Temperature (200ºC) Operation of Smart Microsensors”
Sensors and Actuators A Physical, Vol. 112, No. 2-3, pp. 388-394, 2004.
“Characteristics of High-Resolution Hemoglobin Measurement Microchip Integrated with Signal Processing Circuit”
Japanese Journal of Applied Physics, Vol. 43, No. 4B, pp. 2392-2396, 2004.
“Highly sensitive ion sensors using charge transfer technique”
Sensors and Actuators B Chemical, Vol. 98, pp. 69-72, 2004.
“Selective Vapor-Liquid-Solid Epitaxial Growth of Micro-Si Probe Electrode Area with On-Chip MOSFETs on Si (111) Substrates”
IEEE Transactions on Electron Devices, Vol. 51, No. 3, pp. 415-420, 2004.
“Improvement of an Infrared Light Sensitivity in PZT Photosensitive Field Emitter”
Sensors and Actuators A Physical, Vol. 114, pp. 230-235, 2004.
“Microsensor Systems for High-Temperature Environments Using SOI Technology”
Journal of the Surface Finishing Society of Japan, Vol. 55, No. 1, pp. 10-16, 2004.
Original citation (Japanese)
“SOI技術を用いた高温環境用マイクロセンサシステム”
石田 誠，高尾 英邦
表面技術, 第55巻, 第1号, pp. 10-16, 2004.
“Analysis of Thermal Drift of a Constant Temperature Control Type Three-Axis Accelerometer for High Temperatures”
IEEJ Transactions on Sensors and Micromachines, Vol. 123, No. 12, pp. 583-587, 2003.
“Electron Emission Characteristic from Pb(Zr,Ti)O3 Thin Plate by Infrared Light Irradiation”
Japanese Journal of Applied Physics, Vol. 42, Part 1, No. 9A, pp. 5741-5746, Sept. 2003.
“Signal Condigioning CMOS Circuits Integrated on Si(111) for Image-Recording Sensor of Neural Activity”
IEEJ Transactions on on Sensors and Micromachines, Vol. 123, no. 9, 2003.
“Back-Irradiation Type Photo-Detector Arrays Using Field Emitter Device”
IEICE Transactions on Electronics, vol. E86-C, no. 9, pp. 1805-1809, Sept. 2003.
“Micro Fluidic Integrated Circuits for Signal Processing Using Analogous Relationship between Pneumatic Microvalve and MOSFET”
IEEE/ASME Journal of Microelectromechanical Systems, Vol. 12, No. 4, pp. 497-505, August 2003.
“A Si Nano-Micro-Wire Array on a Si(111) Substrate and Field Emission Device Applications”
Superlattices and Microstructures, Vol. 34, No. 3-6, pp. 567-575, 2003.
“Multichannel 5×5-Site 3-Dimensional Si Microprobe Electrode Array for Neural Activity Recording System”
Japanese Journal of Applied Physics, Vol. 42, Part 1, No. 4B, pp. 2473-2477, April 2003.
“Low Temperature Dependence Three-Axis Accelerometer for High Temperature
Environments with Temperature Control of SOI Piezoresistors”
Sensors and Actuators, A Physical, vol. 104, pp. 53-60, 2003.
“JFET-Integrated CMOS Technology for Low-Noise Sensor Interface Circuits”
IEEJ Transactions on Sensors and Micromachines, Vol. 123, No. 10, pp. 422-428, 2003.
Original citation (Japanese)
“低雑音センサインターフェース回路に向けたJFET混載CMOS技術”
高尾 英邦，浅岡 力弥，澤田 和明，川人 祥二，石田 誠
電気学会論文誌 センサ・マイクロマシン準部門誌, Vol. 123, No. 10, pp. 422-428, 2003.
“SOI Silicon Microsensors for Harsh Environments”
IEEJ Transactions on Sensors and Micromachines, vol. 123, no. 2, pp. 31 - 36, Feb. 2003.
Original citation (Japanese)
“ＳＯＩ技術を用いた耐環境シリコンマイクロセンサ”
石田 誠， 高尾 英邦
電気学会論文誌 センサ・マイクロマシン準部門誌, vol. 123, no. 2, pp. 31 - 36, Feb. 2003.
“A Pneumatically Actuated Full In-Channel Microvalve with MOSFET-Like Function in Fluid Channel Networks”
IEEE/ASME Journal of Microelectromechanical Systems, vol. 11, no. 5, pp. 421-426, Oct. 2002.
“Clock Feedthrough Reduction of CMOS Autozeroed Operational Amplifiers by Two-Stage Self-Compensation”
IEICE Transactions on Electronics, vol. E85-C, no. 7, pp. 1499-1505, July 2002.
“Excess Noise Characteristics of Hydrogenated Amorphous Silicon p-i-n Photodiode Films”
Japanese Journal of Applied Physics, vol. 41, pp. 2552-2555, 2002.
“Fabrication and Properties of Ultra Small Si Wire Arrays with Circuits by Vapor-Liquid-Solid Growth”
Sensors and Actuators A Physical, vol. 97-98, pp. 709-715, 2002.
“Fabrication of the thermopile using SOI structure”
Journal of Sensor Science and Technology, Vol. 11, No. 1, pp. 1-8, 2002.
“A sensor for blood cell counter using MEMS technology”
Sensors and Actuators B Chemical, vol. 83, pp. 77-81, 2002.
“A CMOS Integrated Three-Axis Accelerometer Fabricated with Commercial Sub-micron CMOS Technology and Bulk-Micromachining”
IEEE Transactions on Electron Devices, Vol. 48, no. 9, pp. 1961-1968, 2001.
“Shape Deterioration of Mesa Structures in Post-CMOS Anisotropic Etching of Silicon Microsensors: An Experimental Study”
Sensors and Actuators A Physical, vol.86, no.1-2, pp.115-121, 2000.
“Excess Noise Characteristics of Hydrogenated Amorphous Silicon Avalanche Photodiode Filmes Using Functionally Graded Structure”
Japanese Journal of Applied Physics, vol. 39, Part 1, No. 4B, pp. 204-208, April 2000.
“A Monolithically Integrated Three-Axis Accelerometer using CMOS Compatible Stress-Sensitive Differential Amplifiers”
IEEE Transactions on Electron Devices, vol. 46, no. 1, pp. 109-116, 1999.
“Stress Sensitive Differential Amplifiers Using Piezoresistive Effects of MOSFETs and Their Application to Three-axial Accelerometers”
Sensors and Actuators A Physical, vol. 65, no. 1, pp. 61-68, 1998.
“Analysis and design considerations of three-dimensional vector accelerometer using SOI structure for wide temperature range”
Sensors and Actuators A Physical, No. 55 - 2, pp. 91-97, 1996.
“Three Dimensional Vector Accelerometer using SOI Structure for High Temperature”
IEICE Transactions on Electronics, Vol. J78, C-2, No.10, pp. 495-505, 1995.
(An English translation was published in the Wiley journal listed below.)
H. Takao, Y. Matsumoto, H. Tanaka, H. Seo, M. Ishida, and T. Nakamura
“Three Dimensional Vector Accelerometer using SOI Structure for High Temperature”
Electronics and Communication in Japan, Part2, Vol. 79, No.3, pp. 495-505, 1996.
Original citation (Japanese)
“ＳＯＩ構造を用いた高温用三次元加速度ベクトルセンサ”
高尾 英邦，松本 佳宣，田中 秀一，徐 煕敦，石田 誠，中村 哲郎
電子情報通信学会論文誌, Vol. J78, C-2, No.10, pp. 495-505, 1995.
（英訳論文として下記Wiley誌に掲載）
H. Takao, Y. Matsumoto, H. Tanaka, H. Seo, M. Ishida, and T. Nakamura
“Three Dimensional Vector Accelerometer using SOI Structure for High Temperature”
Electronics and Communication in Japan, Part2, Vol. 79, No.3, pp. 495-505, 1996.
Peer-Reviewed International Conference Papers215 entries
“A Robust Parallel Dual-Axis Tactile Sensor Array for High-Resolution 2D Imaging of Surface Topography and Friction”
Proceedings of IEEE International Conference on Micro Electro Mechanical Systems 2027 (IEEE MEMS2027), (Accepted as an Oral Presentation), Hawaii, U.S.A, Jan. 2027.
“Realization of Tactile Sensing Capable of Simultaneously Capturing Force and Texture”
Proceedings of IEEE International Conference on Mechatronics and Automation 2026 (IEEE ICMA2026), pp. 504-509, DOI: 10.1109/ICMA69663.2026.11647710, Chang Chun, China, Aug. 2026.
"Analysis of Cancer Cell Dynamics using an In Vitro Three-Dimensional Capillary Constriction Model,"
Proceedings of the 29th International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS 2025), Chemical and Biological Microsystems Society, pp. 286-1–286-2, Nov. 2025.
“Simultaneous Acquisition of Viscous and Elastic Properties by Single Measurement Scan of Fingertip-Type Tactile Sensor”
The Digest of Technical Papers of the 23rd International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers 2025), pp. 1604-1607, Orlando, Jun. 2025.
“Novel Tactile-Texture Sensing System with Super-Human Sensing Performance via Deep Learning”
The Digest of Technical Papers of the 23rd International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers 2025), pp. 1596-1599, Orlando, Jun. 2025.
“High-Resolution Hair Texture Sensor with Monolithically Integrated Guiding Structure for Realization of Precise Evaluation and Simple Operation”
Proceedings of 38th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2025), pp. 512–515, DOI: 10.1109/MEMS61431.2025.10918273, Kaohsiung, Jan. 2025.
“Highly Sensitive Drip-Proof Tactile Array Sensor for Slip/Grasp Detection under Laparoscopic Surgery”
Proceedings of 38th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2025), pp. 465–468, DOI: 10.1109/MEMS61431.2025.10917984, Kaohsiung, Jan. 2025.
“Microenvironment Compartmentalization for Optimizing Differentiation of iPS Cells”
Proceedings of 38th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2025), pp. 359-362, DOI: 10.1109/MEMS61431.2025.10917944, Kaohsiung, Jan. 2025.
“Force-Sensor Integrated Touch-Feeling Sensor Capable of Acquiring Subtle Texture Changes Caused by Contact Force”
Proceedings of 38th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2025), pp. 841–844, DOI: 10.1109/MEMS61431.2025.10917390, Kaohsiung, Jan. 2025.
“The First Tool-Channel Tactile Sensor for Simultaneous Acquisition of Tactile and Force Sensations in Micro and Narrow Space under Endoscopic Surgery”
Proceedings of 38th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2025), pp. 1–4, DOI: 10.1109/MEMS61431.2025.10917806, Kaohsiung, Jan. 2025.
“Superhuman Fingertip Sensing Realized by High-Resolution MEMS Tactile Sensors”
Proceedings of The 11th Asia-Pacific Conf. of Transducers and Micro-Nano Technology (APCOT 2024), pp. 315-316, Singapore, Jun. 2024.
“Fabrication of a High-Resolution Tactile Scanner to Quantify the Load Dependence of Texture by Combining ‘Nano-Tactile Sensor’ and a Force Sensor”
Proceedings of The 11th Asia-Pacific Conf. of Transducers and Micro-Nano Technology (APCOT 2024), pp. 385-386, Singapore, Jun. 2024.
“Fabrication of Structural-Color Based Force Sensor with Biocompatibility for Endoscopic Surgery”
Proceedings of The 22nd IEEE Conference on Sensors (IEEE Sensors 2023), 4pages, DOI: 10.1109/SENSORS56945.2023.10325282, Vienna, Austria, Oct. 2023.
“The First Hand-Held Touch Feeling Measurement System Integrated with Force Sensing Mechanism”
Proceedings of The 22nd IEEE Conference on Sensors (IEEE Sensors 2023), 4pages, DOI: 10.1109/SENSORS56945.2023.10325218, Vienna, Austria, Oct. 2023.
“A Quantitative Identification of Moist Feeling by High-Resolution Tactile Sensing”
Proceedings of The 22nd IEEE Conference on Sensors (IEEE Sensors 2023), 4pages, DOI: 10.1109/SENSORS56945.2023.10325179, Vienna, Austria, Oct. 2023.
“Novel Handheld Hair Texture-Scanner Capable of Acquiring Delicate Haptic Changes in Human Hair”
Proceedings of The 22nd IEEE Conference on Sensors (IEEE Sensors 2023), 4pages, DOI: 10.1109/SENSORS56945.2023.10324925, Vienna, Austria, Oct. 2023.
“Nano-Tactile Scanner with Dust-Proof and Drip-Proof Structure for High-Resolution Measurement of Skin Surface Textures”
Proceedings of IEEE Engineering in Medicine and Biology Society (IEEE EMBC 2023), 4pages, DOI: 10.1109/EMBC40787.2023.10340071, Jul. 2023.
“In-Vitro Microfluidic Model For Sepsis-Associated Acute Kidney Injury With Single Cell Imaging”
Digest of Technical Papers of 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers2023), pp. 1055-1057, Jun. 2023.
“Fingerlike Tactile Texture Integrated Sensor with Cold and Warm Sensations of Sub-MM Spatial Resolution”
Proceedings of The 36th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2023), pp. 775-778, DOI: 10.1109/MEMS49605.2023.10052422, Jan. 2023.
“High Resolution Tactile Sensor for Measurement of a Complicated Tactile Feeling of ‘Shittori’ with Moistness”
Proceedings of The 36th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2023), pp. 213-216, DOI: 10.1109/MEMS49605.2023.10052225, Jan. 2023.
“28-mW Fully Embedded AI Techniques with On-site Learning for Low-Power Handy Tactile Sensing System”
Proceedings of 2022 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), 4pages, DOI: 10.1109/VLSI-DAT54769.2022.9768071, Apr. 2022.
“Microfluidic Device for Local Differentiation Induction of iPS Cells-Derived Embryoid Bodies”
Proceedings of MicroTAS 2022 - 26th International Conference on Miniaturized Systems for Chemistry and Life Sciences, pp. 328-329, Oct. 2022.
“Development of a Minimally Invasive High-Resolution Tactile Sensor for Acquiring Delicate Haptic Changes in Hair”
Proceedings of 2022 IEEE 35th Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS2022), pp. 699–702, Tokyo, Jan. 2022.
“Two-Dimensional Microaperture Array for On-Demand Formation of Heterogeneous Gel Fibers”
Proceedings of MicroTAS 2021 - 25th International Conference on Miniaturized Systems for Chemistry and Life Sciences, pp. 1245-1246, Oct. 2021.
“In Vitro Three-Dimensional Model of Capillary Microconstriction for Imaging Cancer Cell Dynamics”
Proceedings of MicroTAS 2021 - 25th International Conference on Miniaturized Systems for Chemistry and Life Sciences, pp. 625-626, Oct. 2021.
“On Site Cell Assembly Using Optically-Driven Microtools with Antibody-Immobilized Surface”
Proceedings of MicroTAS 2021 - 25th International Conference on Miniaturized Systems for Chemistry and Life Sciences, pp. 289-290, Oct. 2021.
“Single-Probe Heat-Pulse Microsensor for Water Transportation Measurement in Plant Shoots”
Proceedings of 2021 IEEE Sensors Conference (IEEE Sensors2021), DOI: 10.1109/SENSORS47087.2021.9639837, Oct. 2021.
“New Value Creation by Nano-Tactile Sensor Chip Exceeding Our Fingertip Discrimination Ability”
Proceedings of 2021 IEEE Hot Chips 33 Symposium, DOI: 10.1109/HCS52781.2021.9567179, Online, Aug. 2021.
“An Antenna-Shaped MEMS Tactile Sensor with Angle Detection Capability”
Proceedings of The 34th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2021), pp. 139–142, Online, Jan. 2021.
“MEMS-Based Multi-Tactile Scanner with 100μm Spatial Resolution of Hardness”
Proceedings of The 34th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2021), pp. 693–696, Online, Jan. 2021.
“Microsensor Device for Minimally Invasive Measurement of Moisture Storage in Plants Shoots”
Proceedings of 2020 IEEE Sensors Conference (IEEE Sensors 2020), pp. 243-246, Online, Oct. 2020.
"Structural Color Based Tactile Sensor for Flexible Endoscopic Surgery to Detect Grab Stage and Organs Hardness"
Proceedings of the 33rd IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2020), pp. 689–692, Vancouver, Canada, Jan. 2020.
"MEMS-Based 'Touch Feeling Scanner' for Quantitative Evaluation of Fingertip Sensation"
Proceedings of the 33rd IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2020), pp. 984–987, Vancouver, Canada, Jan. 2020.
"Highly Sensitive Silicon Slip Sensing Imager for Forceps Grippers Used under Low Friction Condition"
Technical Digest of IEEE International Electron Devices Meeting (IEDM 2019), pp. IEDM19-422–IEDM19-425, San Francisco, USA, Dec. 2019.
"Time Series Classification Using Information of Multiple Dimensions"
Proceedings of Nonlinear Maps and their Applications 2019 (NOMA 2019), pp. 38–39, Palma, Spain, Oct. 2019.
"Stainless Microfluidic Probe with 2D-Array Microapertures"
Proceedings of 23rd International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2019), pp. 1088–1089, Basel, Switzerland, Oct. 2019.
"New Phloem Sap Extraction and Storage Microdevice and Photosynthetic Products Analysis"
Proceedings of The 18th IEEE Conference on Sensors (IEEE Sensors 2019), Montreal, Canada, Oct. 2019.
"Microsensor Device for Simultaneously Measuring Moisture Nutrient Substance Dynamics in Plants"
Proceedings of The 18th IEEE Conference on Sensors (IEEE Sensors 2019), Montreal, Canada, Oct. 2019.
"Parylene-C Coating on High Resolution MEMS Tactile Sensor for Protection of Measurement Surface"
Proceedings of The 18th IEEE Conference on Sensors (IEEE Sensors 2019), Paper ID 1686, Montreal, Canada, Oct. 2019.
"Highly Sensitive Detection of Fine Electrostatic Attraction by Resonance-Driven Silicon-Hair"
Digest of Technical Papers of 20th International Conference on Solid‑State Sensors, Actuators and Microsystems (Transducers 2019) & Eurosensors XXXIII, pp. 1874–1877, Berlin, Germany, Jun. 2019.
"A 0.1µM-Resolution Silicon Tactile Sensor with Precisely Designed Piezoresistive Sensing Structure"
Digest of Technical Papers of 20th International Conference on Solid‑State Sensors, Actuators and Microsystems (Transducers 2019) & Eurosensors XXXIII, pp. 1807–1810, Berlin, Germany, Jun. 2019.
"Simultaneous Measurement of Surface Texture and Elasticity Using Tactile Sensor with Differently Protruded Contactor Array"
Digest of Technical Papers of 20th International Conference on Solid‑State Sensors, Actuators and Microsystems (Transducers 2019) & Eurosensors XXXIII, pp. 454–457, Berlin, Germany, Jun. 2019.
"A Highly Sensitive Planar Silicon-Hair Device Reproducing the Function of Human Hair Follicle"
Proceedings of IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2019), pp. 198–201, Seoul, South Korea, Jan. 2019.
"A Monolithic Fingerprint-Like Tactile Sensor Array Realizing High Resolution Imaging of Spatially Distributed Tactile Information"
Proceedings of IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2019), pp. 182–185, Seoul, South Korea, Jan. 2019.
"Spatial Dissection of Biosamples Using Si Blade Array Device"
Proceedings of the 22nd Int. Conf. on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2018), pp. 1335–1338, Kaohsiung, Taiwan, Nov. 2018.
"Microscale Xylem Sap Flow Sensor Facilitating the Simultaneous Measurement of Flow Velocity and Direction"
Proceedings of EUROSENSORS 2018, Paper ID 7169, Graz, Austria, Sep. 2018.
"Measurement of Touch Feeling on Hair Surface Using High Resolution Two-Axis MEMS Tactile Sensor"
Proceedings of APCOT 2018, 2 pages, Hong Kong, Jun. 2018.
"Extraction of 'Real Friction Coefficient' Depending on Micro Surface Roughness Using High Resolution MEMS Tactile Sensor"
Proceedings of APCOT 2018, 2 pages, Hong Kong, Jun. 2018.
"Fabrication of Xylem Sap Flow Sensor Microneedles for Extending Its Applications"
Proceedings of IEEE-NEMS 2018, Paper PS2-235, Singapore, Apr. 2018.
"Sense of Touch in Submicron Region Realized by Two-Axis Tactile Sensor with a Needle-Like Contactor"
Proceedings of IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2018), pp. 870–873, Belfast, Northern Ireland, Jan. 2018.
"Study of Material Surface Shape Detection Model for MEMS Tactile Sensor by Motion Tracking"
Proceedings of the 2nd Int. Conf. on Intelligent Informatics and BioMedical Sciences (ICIIBMS 2017), pp. 163–164, Okinawa, Japan, Nov. 2017.
“High resolution tactile sensing with silicon MEMS sensors for measurement of fingertip sensation”
Proceedings - International SoC Design Conference 2017 (ISOCC 2017), pp. 17-18, Seoul, Korea, Nov. 2017.
"Laser-Manipulated Microtool with Enzyme-Functionalized Surface for On Site Molecular Processing"
Proceedings of the 21st Int. Conf. on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2017), pp. 433–434, Savannah, Georgia, USA, Nov. 2017.
"Biological Information (pH/EC) Sensor Device for Quantitative Monitoring of Plant Health Conditions"
Proceedings of the 30th IEEE Sensors Conf. (IEEE Sensors 2017), pp. 1–3, Glasgow, UK, Oct. 2017.
"The Fully Wireless Pressure Sensor Based on Endoscopic Image"
Proceedings of the 2017 Int. Conf. on Solid State Devices and Materials (SSDM 2017), pp. 371–372, Sendai, Japan, Sep. 2017.
"Development of a Multi-Electrode Electrovibration Tactile Display with 1 mm Resolution"
Proceedings of the 2017 IEEE World Haptics Conf. (WHC 2017), pp. 659–664, Munich, Germany, Jul. 2017.
"1MPa resistant MEMS slide valve driven by an external actuator for high power fluidic applications"
Digest of Technical Papers of 19th International Conference on Solid‑State Sensors, Actuators and Microsystems (Transducers 2017), pp. 1364–1367, Kaohsiung, Taiwan, Jun. 2017.
"Highly Pure Phloem-Sap-Extraction Sensor Device for Direct Component Analysis of Nutrition in Plant Shoots"
Digest of Technical Papers of 19th International Conference on Solid‑State Sensors, Actuators and Microsystems (Transducers 2017), pp. 1604–1607, Kaohsiung, Taiwan, Jun. 2017.
“Development of high resolution electrostatic tactile display”
Proceedings of 2017 International Conference on Electronics Packaging (ICEP 2017), pp. 484-486, Yamagata, Apr. 2017.
"A 'Micro-Macro' Integrated Planar MEMS Tactile Sensor for Precise Modeling and Measurement of Fingertip Sensation"
Proceedings of the 30th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2017), pp. 223–226, Las Vegas, USA, Jan. 2017.
"On-Site Manipulation of Single DNA Molecules Using Optically-Driven Microchopsticks"
Proceedings of the 30th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2017), pp. 585–588, Las Vegas, USA, Jan. 2017.
"Nanoblade Array for Spatial Dissection of Single Cells and Tissues"
Proceedings of the 30th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2017), pp. 577–580, Las Vegas, USA, Jan. 2017.
"Microscale Phloem Sap Dynamics Measurement Sensor Device for Monitoring the Transport of Nutritive Substances in Plants"
Proceedings of the 29th Int. Microprocesses and Nanotechnology Conf. (MNC 2016), Kyoto, Japan, Nov. 2016.
"Microscale Phloem Sap Extraction Sensor Device for Measuring Biological Information in Plant Branches"
Proceedings of the 29th IEEE Sensors Conf. (IEEE Sensors 2016), 3 pages, Orlando, USA, Oct. 2016.
"A Two-Axis Tactile Sensor with 1μm Diameter Tip of Contactor for Detection Ability of Micro Region Surface Texture"
Proceedings of the 29th IEEE Sensors Conf. (IEEE Sensors 2016), pp. 616–618, Orlando, USA, Oct. 2016.
"Development of 2V Sensitivity Static Electricity Sensor with Vertically Mounted Large Electrode"
Proceedings of the 29th IEEE Sensors Conf. (IEEE Sensors 2016), pp. 1168–1170, Orlando, USA, Oct. 2016.
"Intraluminal Pressure and Temperature Sensor Aimed at Application to Flexible Endoscope Operation"
Proceedings of the 29th IEEE Sensors Conf. (IEEE Sensors 2016), pp. 1114–1116, Orlando, USA, Oct. 2016.
"(3D)² Processing – High Reliability and Low Power Computing for Novel Nano Tactile Sensor Array"
Proceedings of the 13th Int. SoC Design Conf. (ISOCC 2016), pp. 202–203, Jeju, South Korea, Oct. 2016.
"Fabrication and Packaging of an Integrated Pressure and Temperature Sensor with High Immunity Against External Disturbance Under Flexible Endoscopic Operation"
Proceedings of the 2016 Int. Conf. on Solid State Devices and Materials (SSDM 2016), pp. 391–392, Tsukuba, Japan, Sep. 2016.
"Embedded Sensor Packaging on Endoscopy Hood for Real Time Monitoring During Natural Orifice Translumenal Endoscopic Surgery"
Proceedings of the Asia-Pacific Conf. of Transducers and Micro-Nano Technology (APCOT 2016), pp. 259–260, Kanazawa, Japan, Jun. 2016.
"Measurement of Surface Texture on Cloth Samples Using a Highly Sensitive Two-Axis Tactile Sensor"
Proceedings of the Asia-Pacific Conf. of Transducers and Micro-Nano Technology (APCOT 2016), pp. 61–62, Kanazawa, Japan, Jun. 2016.
"A Novel Optical Self-Alignment Technology for Realization of Compact Optical Multi-Gas Sensor System"
Proceedings of IEEE Sensors 2015 Conference (IEEE Sensors 2015), pp. 1988–1990, Busan, Korea, Nov. 2015.
"A Pressure/Temperature Sensor Embedded in an Endoscopy Hood for Intraluminal Monitoring During Flexible Endoscopic Operation"
Proceedings of IEEE Sensors 2015 Conference (IEEE Sensors 2015), pp. 779–781, Busan, Korea, Nov. 2015.
"Reduction of Contact Force Dependence on the MEMS Hardness Sensor Using Reference Plane to Detect Human Body Hardness"
Proceedings of IEEE Sensors 2015 Conference (IEEE Sensors 2015), pp. 267–269, Busan, Korea, Nov. 2015.
"A Rotational MEMS Diffraction Grating for Realization of Micro-Sized Spectroscope System"
Proceedings of the Int. Conf. on Solid State Sensors, Actuators and Microsystems (TRANSDUCERS 2015), pp. 208–211, Anchorage, USA, Jun. 2015.
"Generation of Low-Temperature Atmospheric Pressure Plasma-Jet Patternable Array at a 320 µm Pitch Channel Array"
Proceedings of the Int. Conf. on Solid State Sensors, Actuators and Microsystems (TRANSDUCERS 2015), pp. 1838–1841, Anchorage, USA, Jun. 2015.
"Development of Magnetically Driven Microvalve Using Photosensitive SU-8/Fe Composite"
Proceedings of the Int. Conf. on Solid State Sensors, Actuators and Microsystems (TRANSDUCERS 2015), pp. 1838–1841, Anchorage, USA, Jun. 2015.
"A New Extraction Method of Information for Quantification of The Sense of Touch Using A Novel Two-Axis Tactile Sensor"
Proceedings of the Int. Conf. on Solid State Sensors, Actuators and Microsystems (TRANSDUCERS 2015), pp. 1191–1194, Anchorage, USA, Jun. 2015.
"A Tactile Sensor with The Reference Plane for Detection Abilities of Frictional Force and Human Body Hardness Aimed to Medical Applications"
Proceedings of the 28th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2015), pp. 253–256, Estoril, Portugal, Jan. 2015.
"A Novel Configuration of Tactile Sensor to Acquire the Correlation between Surface Roughness and Frictional Force"
Proceedings of the 28th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2015), pp. 245–248, Estoril, Portugal, Jan. 2015.
"Silicon Integrated Tactile Sensor Arrays Based on CMOS Compatible MEMS Fabrication Technology"
Proceedings of the 7th ISSS Int. Conf. on Smart Materials Structures and Systems (ISSS 2014), Invited4A (7 pages in USB), Bangalore, India, Jul. 2014.
"Dual-Axis Hybrid-MEMS Mirror Having Si and Polymer Hinges for Large-Area 2D Raster Scan"
Proceedings of the 2014 Int. Conf. on Optical MEMS and Nanophotonics (OMN), pp. 167–168, 2014.
"Microscale Phloem Flow Sensor Fabricated Using MEMS Technology for Measuring Biological Information of Plant Branches"
Proceedings of Malaysia–Japan International Conference on Nanoscience, Nanotechnology and Nanoengineering 2014 & IC‑NET 2014, pp. 141, Mar. 2014.
"Patternable Atmospheric-Pressure Plasma Jet Array Generated by an Integrated Microfluidic Device"
Proceedings of the 6th Int. Symp. on Advanced Plasma Science and Its Applications for Nitrides and Nanomaterials (ISPlasma2014), 2 pages in CD-ROM, Mar. 2014.
"Assist-Free Assembly Technique of Standing Optical Devices on Soft Spring Actuator Stages"
Proceedings of the 27th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS2014), pp. 433–436, San Francisco, USA, Jan. 26-30, 2014.
“Integrated Silicon MEMS Technology and Novel Functional Sensor Devices”
Proceedings of 26th International Microprocesses and Nanotechnology Conference (MNC2013), pp. 8B-8-1 (2pages), Sapporo, Japan, Nov. 5-8, 2013.
“Iintegration of Angular Rate Sensor on Large Deflection Polymer-MEMS Mirror”
Proceedings of IEEE Optical MEMS & Nanophotonics Conference (OMN2013), pp.69-70, Aug. 18-22, Kanazawa, Japan, 2013.
“Dual-Axis Polymer-MEMS Mirror Made of Photosensitive Nanocomposite”
Proceedings of IEEE Optical MEMS & Nanophotonics Conference (OMN2013), pp.101-102, Aug. 18-22, Kanazawa, Japan, 2013.
“Patternable Atmospheric-Pressure Plasma Jets with Gas Discharge in Microfluidic Channel Array”
Proceedings of 26th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2013), pp. 205-208, Taipei, Taiwan, Jan. 20-24, 2013.
“Optically-Driven Microstructures for Manipulating Single DNA Molecule under Fluorescence Microscop”
Proceedings of 38th International Conference on Micro and Nano Engineering (MNE2012), Ref.P409-355 (2pages in CD-ROM), 2012.
“Fast whole blood testing for detecting biomarkers by size-exclusion SPR sensing”
Proceedings of The 16th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS2012), pp. 186-188, 2012.
“DNA Fiber Preparation Technique on a Chip for Clinical Diagnosis”
Proceedings of The 16th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS2012), pp. 272-274, 2012.
“Large Area 3D Microfabrication Technique by Multidirectional Photolithography for a chromosome extension chip”
Proceedings of The 16th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS2012), pp. 1822-1824, 2012.
“Development of a Universal Integrated Micro Cell Culture System”
Proceedings of The 6th International Conference on Nano/Molecular Medicine and Engineering (IEEE NANOMED2012), pp. 70-73, 2012.
“A Novel Integrated Tactile Image Sensor for Detection of Surface Friction and Hardness Using the Reference Plane Structure”
Proceedings of IEEE Sensors2012 Conference, 6411053 (3 pages), Taipei, Taiwan, Oct. 28-31, 2012.
“A novel capacitive absolute pressure sensor using SON technology”
Proceedings of IEEE Sensors2012 Conference, 6411068 (3 pages), Taipei, Taiwan, Oct. 28-31, 2012.
“A Post-CMOS Process of High Adhesion SU-8 Structure to Apply to Sensor Device”
Proceedings of 25th International Microprocesses and Nanotechnology Conference (MNC2012), Kobe, Japan, Oct. 30-Nov. 2, 2012.
“Improvement of Processing Reproducibility for a Magnetic-Driven Microstructure Made of Photosensitive Nanocomposite”
Proceedings of 2012 International Conference on Optical MEMS & Nanophotonics, 2pages in CD-ROM, Banf, Canada, Aug. 6-9, 2012.
“Design and Fabrication of Electrostatically Driven In-Plane MEMS Rotational Mirror with Electrostatic Rotary Encoder”,
Proceedings of 2012 International Conference on Optical MEMS & Nanophotonics, 2pages in CD-ROM, Banf, Canada, Aug. 6-9, 2012.
“Evaluation of Highly Sensitive C/V Converter with an Inverter for CMOS/MEMS Integration”
Proceedings of World Automation Congress 2012 (WAC2012), 4pages in CD-ROM, Puert Varralta, Mexico, June 24-27, 2012.
“Cell Culture on MEMS Materials in Micro-Environment Limited by a Physical Condition”
Technical digest of 7th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS2012), W4A-3, March 5-8, Kyoto, Japan, 2012.
“Improvement of Coating Uniformity for Thick Photoresist Using a Partial Spray Coat”
Technical digest of 7th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS2012), W3P-33, March 5-8, Kyoto, Japan, 2012.
“Self-Aligned Fabrication Process for Active Membrane Made of Photosensitive Nanocomposite”
Proceedings of 25th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2012), pp. 1181-1184, Paris France, Jan. 29th-Feb. 2nd, 2012.
“Air-Flow Based Multifunctional Tactile Display Device with Multi-Jet Integrated Micro Venturi Nozzle Array”
Proceedings of 25th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2012), pp. 148-151, Paris France, Jan. 29th-Feb. 2nd, 2012.
“Flexible Silicon Triaxial Tactile Imager with Integrated 800µm-Pitch Sensor Pixel Structures on a Diaphragm,”
Proceedings of IEEE Sensors2011 Conference, pp. 663-666, Limerick Ireland, Oct. 28-31, 2011.
“A Venturi-type Micro Mist Generator Fabricated by MEMS Technology and Its Application to Local Surface Cooling of Target Objects”,
Proceedings of 24th International Microprocesses and Nanotechnology Conference (MNC 2011) , 2pages in CD-ROM, ANA Hotel Kyoto, Japan, October 24-27, 2011.
“In-pixel type small-scale integrated ”C-V converter with chopper stabilized CMOS inverter”,
Proceedings of 2011 International Conference on Solid State Devices and Materials (SSDM2011), GH-2-3, pp. 1039-1040, Sept. 28-30, Nagoya, Japan, 2011.
“Fabrication and evaluation of polymer MEMS mirror based on the mechanical characteristic of polymer containing magnetic particles”
Proceedings of 16th International Conference on Optical MEMS and Nanophotonics (optical-MEMS2011), 2pages in CD-ROM, PO8-10011780, Aug.8-11, Istanbul, Turkey, 2011.
“Design and Fabrication of polymer MEMS Mirror Based on the Mechanical Characteristic Evaluation of Polyimide Materials”
Proceedings of 16th International Conference on Optical MEMS and Nanophotonics (optical-MEMS2011), 2pages in CD-ROM, P012-10016921, Aug.8-11, Istanbul, Turkey, 2011.
“Zero Temperature Coefficient Gas-Seald Pressure Sensor Using Mechanical Temperature Compensation”,
Digest of Technical papers of the 16th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’ 11), pp. 116-119, June 5-9, Beijing, China, 2011.
”Fabrication of a Magnetically-Driven Microstructure Made of Magnetic Nanoparticles/SU-8 Composite”
Proceedings of the 6th International Conference on Microtechnologies in Medicine and Biology (MMB2011) , pp.74-75, May 4-6, Lucerne Switzerland, 2011.
“Crystalline Anisotropic Dry Etching for Single Crystal Silicon”
Proceedings of The 24th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2011), pp. 608-611, Jan.23-27, Cancun Mexico, 2011.
“Micro Fluidic Circuit Design with “SPICE Simulation”,
Proceedings of The 24th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2011), pp. 608-611, Jan.23-27, Cancun Mexico, 2011.
”High-Throughput FISH Microchip for Clinical Genetics”
Proceedings of the 14th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS2010), pp. 702-704, Oct. 3 -7, Groningen, The Netherlands, 2010.
“A Robust and Sensitive Silicon Tactile Imager with Individually Formed SU-8 Protective Layers on Piezoresistor Pixels”
Proceedings of IEEE Sensors 2010 Conference, pp. 2079-2082, Hawaii, USA, Nov. 1-4, 2010.
”Low Cost and Large Deflection Angle Polymer MEMS Mirror Using Glass Substrate”
Proceedings of 2010 International Conference on Optical MEMS & Nanophotonics, M1-2, pp. 29-30, August 9-12, 2010.
” Vertical Comb-Drive MEMS Mirror with Sensing Function for Phase-Shift Device”
Proceedings of 2010 International Conference on Optical MEMS & Nanophotonics, M1-2, pp. 5-6, August 9-12, 2010.
“A Membrane Tyep Si-MEMS Tactile Imager with Fingerprint Structure for Realization of Slip Sensing Capability”
Proceedings of The 23rd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2010), pp. 608-611, Jan. 24-28, HongKong, China, 2010.
"Fabrication-modal sensor with pH, EC and temperature sensing areas for agriculture application"
IEEE Sensors 2009 Conference, C5L-C, Christchurch, New Zealand, October, 2009.
"Fabrication of Smart Electrochemical Sensor with CMOS Integrated Circuits"
2009 International Conference on Solid State Devices and Materials (SSDM2009), P-11-11, Sendai, Miyagi, Japan, October, 2009.
“Three Dimensional Surface-Shape Tactile Imager with Fingertip-Size Silicon Integrated Sensor-Membrane”
Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 2186-2189, June 21-25, Denver, Colorado, USA, 2009.
“2-Dimensional Potassium Ion Image Sensor Aiming for Label-Free Dynamic Imaging of Living-Cell Activity”
Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 916-919, June 21-25, Denver, Colorado, USA, 2009.
“2-Dimentional Label-Free Acetylcholine Image Sensor For Imaging Neuronal Communication"
Digest of Technical papers of the 15th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers’09), pp. 975-978, June 21-25, Denver, Colorado, USA, 2009.
“Non-Linear Fluidic Integrated Circuits Realized by Pneumatic-Field Effect Transistors with Controllable Output Resistance”
Proceedings of The 22nd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2009), pp. 503-506, Jan. 25-29, Sorrento, Italy, 2009.
“High-Performance and Multifunctional Tactile Image Sensors Realized by Silicon CMOS/MEMS Technology”
Proceedings of International Conference on MEMS 2009 (ICMEMS2009), 6pages in CD-ROM, Jan. 3-5, IIT-Madras, Chennai, India, 2009.
“Multipurpose microchip system for photometric chemical analysis integrated with temperature controlled solution mixer”
Proceedings of 12th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2008), pp. 1057-1059, San Diego, USA, Oct. 2008.
“Multimodal pH and light imaging devices for dynamic chemical reaction observation”
Proceedings of 12th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2008), pp. 326-328, San Diego, USA, Oct. 2008.
“High performance acetylcholine biosensor using charge transfer technique”
Proceedings of 12th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2008), pp. 459-461, San Diego, USA, Oct. 2008.
“Silicon MEMS Tactile Imager Using Flexible Deformation of Integrated Pixel Array”
Proceedings of World Automation Congress 2008 (WAC2008), 4pages in CD-ROM, Kona, Hawai, Sept.28th-Oct.2nd, 2008.
“Fabrication of Silicon-MEMS Highly Sensitive Three-Axis Micro Force Sensor Array”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2008), 4pages in CD-ROM, Tainan, Taiwan, 22-26 June, 2008.
“Fabrication of Al/Si Schottky Diode in Standard CMOS Process for Microwave Detectors Used in Integrated Wireless Sensor Network”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2008), 4pages in CD-ROM, Tainan, Taiwan, 22-26 June, 2008.
“Improvement in Filter-Less Fluorescence Sensor Capability by Optimization of Potential Distribution”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2008), 4pages in CD-ROM, Tainan, Taiwan, 22-26 June, 2008.
“32×32 CMOS DNA Sensor Array Using Charge Transfer Technique”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2008), 4pages in CD-ROM, Tainan, Taiwan, 22-26 June, 2008.
“Source-Follower Amplicier Array with Vapor-Liquid-Solid Grown Silicon Microprobe Electrodes on Silicon (111) Substrate”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2008), 4pages in CD-ROM, Tainan, Taiwan, 22-26 June, 2008.
“Nano-Vacuum Device in Local Micro-Vacuum Package for Vacuum-CMOS Fused LSI”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2008), 4pages in CD-ROM, Tainan, Taiwan, 22-26 June, 2008.
“Smart Microfluidic Devices with Micro Bridge Heater Fabricated by CMOS Compatible Process”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2008), 4pages in CD-ROM, Tainan, Taiwan, 22-26 June, 2008.
“Evaluation of Antenna-Integrated 315MHz Transmitter for Smart Microsensors”
Proceedings of International Networked Sensing Systems 2008 (INSS2008), pp. 74-79, Kanazawa, Japan, June 17-19, 2008.
“Silicon smart microchips for intelligent sensing”
Digest of Technical Papers of 2008 Symposium on VLSI Technology (VLSI 2008), pp. 6-9, Honolulu, USA, June 17-19, 2008.
“Post-CMOS Integration Technology of Thick-Film SOI MEMS Devices Using Micro Bridge Interconnections”
Proceedings of 21st IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2008 ), pp. 359-362, January 13-17, Tucson, Arizona, USA, 2008.
“Multi-functional Monolithic-MEMS Tactile Imager Using Flexible Deformation of Silicon IC”
Proceedings of IEEE 2007 Custom Integrated Circuits Conference (IEEE CICC2007), pp. 131-134, September 16-19, San Jose, USA, 2007.
“Low-noise operation of charge-transfer-type ph sensor using charge accumulation technique”
Proceedings of 11th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2007), pp. 479-481, Paris, France, Oct. 2007.
“High performance penicillin sensor using charge transfer technique”
Proceedings of 11th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2007), pp. 1255-1257, Paris, France, Oct. 2007.
“A Robust and Sensitive Silicon-MEMS Tactile-Imager with Scratch Resistant Surface and Over-Range Protection”
Digest of Technical papers of the 14th International Conference on Sensors, Actuators, and Microsystems (Transducers’07), pp. 1465-1468, June 10-14, Lyon, France, 2007.
“Novel Absorption Photometry Microchip with No Reference Solution”
Digest of Technical papers of the 14th International Conference on Sensors, Actuators, and Microsystems (Transducers’07), pp. 2143-2146, June 10-14, Lyon, France, 2007.
“On-Chip Multi Wavelength Detection Sensor for Real Time Monitoring of Fluorescence and Opacity”
Digest of Technical papers of the 14th International Conference on Sensors, Actuators, and Microsystems (Transducers’07), pp. 1971-1974, June 10-14, Lyon, France, 2007.
“Charge Transfer Type pH Sensor with Super High Sensitivity”
Digest of Technical papers of the 14th International Conference on Sensors, Actuators, and Microsystems (Transducers’07), pp. 1881-1884, June 10-14, Lyon, France, 2007.
“Si Micro Probe and SiO2 Micro Tube Array Integrated with nMOSFETs”
Digest of Technical papers of the 14th International Conference on Sensors, Actuators, and Microsystems (Transducers’07), pp. 1381-1384, June 10-14, Lyon, France, 2007.
“32×32 pH Image Sensor for Real Time Observation of Biochemical Phenomena”
Digest of Technical papers of the 14th International Conference on Sensors, Actuators, and Microsystems (Transducers’07), pp. 1311-1314, June 10-14, Lyon, France, 2007.
“A Novel RF Induced DC Power Supply System for Integrated Ubiquitous Micro Sensor Devices”
Digest of Technical papers of the 14th International Conference on Sensors, Actuators, and Microsystems (Transducers’07), pp. 907-910, June 10-14, Lyon, France, 2007.
“High Performance Blood Glucose Sensor Using Charge Transfer Technique”
Digest of Technical papers of the 14th International Conference on Sensors, Actuators, and Microsystems (Transducers’07), pp. 855-858, June 10-14, Lyon, France, 2007.
“RF-Powered Silicon-MEMS Microsensors for Distributed and Embedded Sensing Applications”
Proceedings of International Networked Sensing Systems 2007 (INSS2007), pp. 35-42, Braunchweig, Germany, June 6-8, 2007.
“Evaluation of Monolithically Integrated Antennas and RF Transmitters for Silicon Smart Micro Sensors with Wireless-Communication Ability”
Proceedings of The 5th IEEE Conference on Sensors (IEEE Sensors 2006), pp. 34-36, Daegu, Korea, October 22-25, 2006.
“Sensing characteristics of charge transfer type pH sensor by accumulative operation”
Proceedings of The 5th IEEE Conference on Sensors (IEEE Sensors 2006), pp. 144-147, Daegu, Korea, October 22-25, 2006.
“Piezoresistive gas flow sensors by deep RIE technology”
Proceedings of The 5th IEEE Conference on Sensors (IEEE Sensors 2006), pp. 1115-1118, Daegu, Korea, October 22-25, 2006.
“Thermal characteristics in motion sensor for high temperature environments”
Proceedings of The 5th IEEE Conference on Sensors (IEEE Sensors 2006), pp. 1191-1194, Daegu, Korea, October 22-25, 2006.
“Silicon MEMS Sensors and Devices Harmonized with LSI Technology”
International Workshop on Micro/Nano Science and Engineering for the 21st Century
pp. 49-52, Ritsumeikan University, Kusatu, Shiga, Japan, October 12-13, 2006.
“A Self-Compensated Fully Differential SOI-CMOS Operational Amplifier for Wide Temperature Operation of Silicon Smart Sensors up to 275ºC”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2006), pp.146 & 4pages (CD-ROM), Singapore, 25-28 June, 2006.
“Effect of High Drain Bias on Stress Sensitivity in MOSFETs”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2006), pp.145 & 4pages (CD-ROM), Singapore, 25-28 June, 2006.
“A Wide Dynamic Range Photogate type Image Sensor Based on Self Suppression Principle”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2006) , pp.153 & 4pages (CD-ROM), Singapore, 25-28 June, 2006.
“A Fabrication of P-N Junction Using Si-Micro-Probe Array by In-Situ Doping VLS Growth”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2006) , pp.132 & 4pages (CD-ROM), Singapore, 25-28 June, 2006.
“Micro SiO2 Tube Array on Si(111) Substrates for Intelligent Devices Using Vapor-Liquid-Solid Method and Selective Si Etching by XeF2 Gas”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2006) , pp.272 & 4pages (CD-ROM), Singapore, 25-28 June, 2006.
“Smart micro sensors with RF transmitter for intelligent human sensing system”
Proceedings of IEEE Sensors Applications Symposium (SAS2006), pp. 78-81, Houston, Texas USA, February 7-9, 2006.
“Two-Dimensional Silicon Smart Tactile Image-Sensor with Single Sensing Diaphragm Actuated by Vibrating Pressure for Simultaneous Detection of Force and Object Hardness Distributions”
Proceedings of The 19th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2006), pp. 602-605, Istanbul, Turkey, Jan. 22-26, 2006.
“Ultimate 1/f noise reduction in JFET-based Operational Amplifiers for High-Performance CMOS Integrated Smart Microsensors”,
Conference Proceedings of The International Conference on Electrical Engineering 2005 (ICEE2005), DM1-10, ICEE-F0144, July 10-14, Kunming, China, 2005.
“Fabrication of Temperature Controlled Precise Three-Axis Accelerometer with Stabilized Temperature Characteristics over a Wide Temperature Range”,
Conference Proceedings of The International Conference on Electrical Engineering 2005 (ICEE2005), PS2-46, ICEE-F0411, July 10-14, Kunming, China, 2005.
“Multifunctional Smart Tactile-Image Sensor with Integrated Arrays of Strain and Temperature Sensors on Single Air-Pressurized Silicon Diaphragm”,
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 45-48, June 5-9, Seoul Korea, 2005.
“Smart Microfluidic Electrochemical DNA Sensors Integrated Signal Processing Circuits”
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 279-282, June 5-9, Seoul Korea, 2005.
“Highly Sensitive Electron-Emission-Type Infrared Sensor Using a Single Crystalline LiNbO3”
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 581-584, June 5-9, Seoul Korea, 2005.
“Improvement of thermal Response in Temperature Controlled Precise Three-Axis Accelerometer with Stabilized Characteristics over a Wide Temperature Range”,
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 800-803, June 5-9, Seoul Korea, 2005.
“Performance and Relliability Study of Si(111) CMOS Subjected to High Mechanical Stress for Smart Sensor Application”,
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 871-874, June 5-9, Seoul Korea, 2005.
“The Fabrication of Filter-less Fluorescence Detection Sensor Array Using CMOS Image Sensor Technique”,
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 1026-1029, June 5-9, Seoul Korea, 2005.
“Fabrication of Two-Dimensional pH CMOS Image Sensors and Real Time Imaging of Chemical Reaction”,
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 1138-1141, June 5-9, Seoul Korea, 2005.
“Neural Recording with Low-Invasive Si Microprobe Array”,
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 1222-1225, June 5-9, Seoul Korea, 2005.
“Wafer-Level Integration Technology of Surface Mount Devices Using Automatic Parts Alignment Technology with Vibration”,
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 1322-1325, June 5-9, Seoul Korea, 2005.
“Evaluation of Novel Blood-Hemoglobin Measurement Microsystem with Integrated Processing Circuits and Si(110) 45º-Mirrors”,
Digest of Technical papers of the 13th International Conference on Sensors, Actuators, and Microsystems (Transducers’05), pp. 2007-2010, June 5-9, Seoul Korea, 2005.
“Three-dimensional multichannel Si microprobe electrode array chip for analysis of the nervous system”,
2004 International Electron Device Meeting (IEEE IEDM2004), pp. 1013-1016, San Francisco, USA, 2004.
“Novel Filter Less Fluorescence Detection Sensor Array for DNA Micro Chip”,
Proceedings of 8th International Conference on Miniaturized Systems for Chemistry and Life Sciences, pp. 491-493, Malmo, Sweden, Sept. 2004.
“Fabrication of pH CMOS Image Sensor for Chemical Reaction Imaging”,
Proceedings of 8th International Conference on Miniaturized Systems for Chemistry and Life Sciences, pp. 440-442, Malmo, Sweden, Sept. 2004.
“Neural Recording Chip with Penetrating Si Microprobe Electrode Array by Selective Vapor-Liquid-Solid Growth Method”,
Proceedings of the 26th Annual International Conference of the IEEE Eng. Med. Biological Society (IEEE EMBS), pp. 2066-2069, San Francisco, USA, 2004.
“Realization of n-Type and p-Type Si-Microprobe Array Using In-Situ Doping with Selective Vapor-Liquid-Solid (VLS) Growth Method”
Extended Abstracts of the 2004 International Conference on Solid State Devices and Materials (SSDM2004), pp. 176-177, Tokyo, Japan, 2004.
“Low-Noise Fully Differential Amplifiers for High Resolution Smart Sensors Using JFET-CMOS Technology”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT MNT 2004), pp.20-25, Sapporo, Japan, July 4-7, 2004.
“Device Characteristics of MOSFETs for Smart Sensor Systems on Si(111)”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT MNT 2004), pp.112-116, Sapporo, Japan, July 4-7, 2004.
“Thermal Response Analysis of a Temperature Controlled Three-axis Accelerometer for High Temperatures with Integrated Microheaters and Temperature Sensors”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT MNT 2004), pp.449-452, Sapporo, Japan, July 4-7, 2004.
“Fabrication of the High Temperature Silicon Pressure Sensor”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT MNT 2004), pp.749-752, Sapporo, Japan, July 4-7, 2004.
“MEMS Based High Dose Radiation Resistant SOI Pressure Sensor”
Proceedings of Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT MNT 2004), pp.1317-1321, Sapporo, Japan, July 4-7, 2004.
“Silicon Smart Tactile Image Sensor with Pneumatically Swollen Single Diaphragm Structure”
Proceedings of The 17th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2004), pp.846-849, Maastricht, The Netherlands, Jan. 25-29, 2004.
“Analysis and Experimental Verification of Thermal Drift in a Constant Temperature Control Type Three-Axis Accelerometer for High Temperatures with a Novel Composition of Wheatstone Bridge”
Proceedings of The 17th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2004), pp.241-244, Maastricht, The Netherlands, Jan. 25-29, 2004.
“Fabrication and Analysis of Thermal Drift of a Constant Temperature Control Type Three-Axis Accelerometer for High Temperatures”
Proceedings of International Sensor Conference 2003, pp. 79-80, Taegu, Korea, Nov. 14-15, 2003.
“Integrated Electrochemical DNA Sensors with Microfluidic Channel Reactor”
The Seventh International Conference on Miniaturized Chemical and Biochemical Analysis Systems (micro-TAS 2003), Vol. 1, pp. 371-374, Squaw Valley, USA, Oct. 5-9, 2003.
“A High Resolution Hemoglobin Measurement Cell Integrated with Signal Processing Circuit”
Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials (SSDM2003), pp. 694-695, Tokyo, Japan, 2003.
“Electron Emission Characteristics from a Single Crystalline Ferroelectric Material by An Infrared Light Irradiation”
Technical Digest of The 16th International Vacuum Microelectronics Conference (IVMC2003), pp. 69-70, July 7-11, 2003.
“A Thermo-Pneumatic In-Channel Microvalve with PDMS Diaphragm for Integrated Blood Examination System on Silicon”
Digest of Technical Papers of The 12th International Conference on Solid - State Sensors, Actuators, and Microsystems (IEEE Transducers '03), pp. 139-142, Boston, USA, June 8-12, 2003.
“A Precision SOI-CMOS Front-End Amplifier For Smart Microsensors Applicable to Severe Operation Environment with Large Temperature Variation”
Digest of Technical Papers of The 12th International Conference on Solid - State Sensors, Actuators, and Microsystems (IEEE Transducers '03), pp. 448-451, Boston, USA, June 8-12, 2003.
“CMOS Signal Processing Circuits on Si (111) for Neural Activity Image-Recording with Epitaxially Grown Micro-Si Probes”
Digest of Technical Papers of The 12th International Conference on Solid - State Sensors, Actuators, and Microsystems (IEEE Transducers '03), pp. 1687-1690, Boston, USA, June 8-12, 2003.
“Neuron Size Si Probe Array Fabricated on Integrated Circuits for Multichannel Electrode”
Digest of Technical Papers of The 12th International Conference on Solid - State Sensors, Actuators, and Microsystems (IEEE Transducers '03), pp. 1679-1682, Boston, USA, June 8-12, 2003.
“Improvement of Infrared Lights Sensitivity on PZT Emitter”
Digest of Technical Papers of The 12th International Conference on Solid - State Sensors, Actuators, and Microsystems (IEEE Transducers '03), pp. 1622-1625, Boston, USA, June 8-12, 2003.
“Novel Fused Sensor For Photo and Ion Sensing”
Digest of Technical Papers of The 12th International Conference on Solid - State Sensors, Actuators, and Microsystems (IEEE Transducers '03), pp. 1023-1026, Boston, USA, June 8-12, 2003.
“Fabrication of Avalanche Multiplication type CMOS Imager using a-Si:H photodiode film”
Extended Abstracts of the 2003 IEEE Workshop on Charge-Coupled Devices and Advanced Image Sensors, pp. 49-53, Germany, May 2003.
“Analysis and Experimental Verification of Micro Fluidic Integrated Circuits Using Analogous Relationship between Pneumatic Microvalve and MOSFET”
Proceedings of IEEE The 16th Annual International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2003), pp.185-188, Kyoto, Japan, Jan. 19-23, 2003.
“A Three-Axis Accelerometer for High Temperatures with Low Temperature Dependence Using a Constant Temperature Control of SOI Piezoresistors”
Proceedings of IEEE The 16th Annual International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2003), pp.478-481, Kyoto, Japan, Jan. 19-23, 2003.
“Field Electron Emission Device Using Silicon Nano-Wires”
2002 International Electron Device Meeting (IEEE IEDM 2002), pp.401-404, San Francisco, USA, Dec. 9-11, 2002.
“Smart Chip with Selective Micro-Probes on Si(111) IC Chips for Detecting Nerve Potential”
Proceedings of International Conference on Smart Materials Structures and Systems (ISSS-SPIE2002), pp. 302-309, Bangalore, India, Dec., 2002.
“A Silicon Microchip for Blood Hemoglobin Measurement Using Multireflection Structure”
Proceedings of The Fifth International Conference on Miniaturized Chemical and Biochemical Analysis Systems (micro-TAS 2001), pp. 363-364, Monterey CA, USA, Oct. 21-25, 2001.
“Excess Noise Characteristics of a-Si:H p-i-n Photodiode Films”
Extended Abstracts of the 2001 International Conference on Solid State Devices and Materials (SSDM2001), pp. 600-601, Tokyo, Japan, Sept. 26-28, 2001.
"Properties of CMOS on Si(111) for nerve-potential smart sensor with Si probe array"
Proceedings of The International Conference on Electrical Engineering 2001 (ICEE2001), pp. 1580-1583, 2001.
“A pneumatically-actuated silicon microvalve and its application to functional fluidic integrated circuits”
Digest of Technical Papers of The 11th International Conference on Solid - State Sensors and Actuators (Transducers '01), pp. 946-949, Munich, Germany, June 10-14, 2001.
“A durable sensor for blood cell counter using MEMS technology”,
Digest of Technical Papers of The 11th International Conference on Solid - State Sensors and Actuators (Transducers '01), pp. 1198-1201, Munich, Germany, June 10-14, 2001.
“Fabrication and Properties of Ultra Small Si Wire Arrays by Vapor-Liquid-Solid Growth with Circuits”,
Digest of Technical Papers of The 11th International Conference on Solid - State Sensors and Actuators (Transducers '01), pp. 1066-1069, Munich, Germany, June 10-14, 2001.
“A Concept and Design of Integrated Temperature Control System in SOI Sensors for Precision Operation over a Wide Temperature Range”
Proceedings of International Conference on Electrical Engineering 2000 (ICEE2k), pp. 259-262, Kitakyusyu, Japan, July 24-27, 2000.
“Fabrication of A Three-Axis Accelerometer Integrated with Commercial 0.8µm-CMOS Circuits”,
Proceedings of IEEE The 13th Annual International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2000), pp.781-786, Miyazaki, Japan, Jan. 23-27, 2000.
“Design of a Precision Chopper Amplifier for High Temperature Applications Using a Leakage Current Compensation Technique”
Proceedings of XIV Design of Circuits and Integrated Systems Conference (DCIS ‘99), pp. 155-160, Palma de Mallorca, Spain, Nov. 16-19, 1999.
“Excess Noise Characteristics of Hydrogenated Amorphous Silicon Avalanche Photodiode Filmes Using Functionally Graded Structure”
Proceedings of the International Conference on Solid-State Devices and Materials (SSDM ’99), Japan, 1999.
“A Monolithically Integrated Three Axial Accelerometer Using Stress Sensitive CMOS Differential Amplifiers”
Digest of Technical Papers of The 9th International Conference on Solid-State Sensors and Actuators (Transducers '97), vol. 2, pp. 1173-1176, Chicago, USA, June 16-19, 1997.
“Device Characteristics of Three-Dimensional Vector Accelerometer Using SOI Structure for Wide Temperature Range”
Proceedings of the 6th Conference on Sensor Technology, pp. 517-524, Daegu, Korea, Nov. 10-11, 1995.
“Three-Dimensional Vector Accelerometer Using SOI Structure for High Temperature”
Digest of Technical Papers of The 8th International Conference on Solid-State Sensors and Actuators (Transducers '95), pp. 683-686, Stockholm, Sweden, June 25-29, 1995.
Books11 entries
Sensors in Biomedical Engineering: Research and Development in Advanced Medical Sensing
Contributed section: Chapter 9, MEMS Endoscopic Sensors (Ultra-Minimally Invasive Endoscopic Medical Technology), pp.160-173
CMC Publishing Co., Ltd., published May 2022
Original citation (Japanese)
センサ医工学 -最新医療センシングの研究開発-
高尾 英邦（分担執筆）
担当箇所：第９章MEMS内視鏡センサ（超低侵襲内視鏡医療技術），pp.160-173
（株）シーエムシー出版，2022年5月出版
Technologies for Creating Intended Tactile Sensations and Textures
Contributed section: Chapter 4, Section 3 [3], “MEMS Tactile Sensors for Precision Measurement of Soft Material Surfaces,” pp.436-445
Science & Technology Co., Ltd., published Nov. 2017
Original citation (Japanese)
狙いどおりの触覚・触感をつくる技術
高尾 英邦（分担執筆）
担当箇所：第4章第3節[3] 「柔軟な素材表面を高精度で測定するMEMS 触覚センサ」，pp.436-445
サイエンス＆テクノロジー（株），2017年11月出版
Electrical Engineering Handbook (7th Edition)
Contributed section: Part 10, Chapter 3, Section 8, “Fabrication Processes for Integrated Systems” (3 pages)
The Institute of Electrical Engineers of Japan, published Sep. 2013
Original citation (Japanese)
電気工学ハンドブック（第七版）
高尾 英邦（分担執筆）
担当箇所：10編第3章8節「集積化システムの製作プロセス」（3ページ）
（社）電気学会、2013年9月出版
Handbook of Heterogeneous Integration
Contributed section: Chapter 13, Circuit Design for Integrated MEMS Sensors, pp.104-110
CMC Publishing Co., Ltd., published Nov. 2012
Original citation (Japanese)
異種機能集積化ハンドブック
高尾 英邦（分担執筆）
担当箇所：第13章 集積化MEMSセンサ実現のための回路設計，pp104-110
（株）シーエムシー出版 2012年11月出版
Electronic Journal Archives No. 186
Sensor–CMOS Integration Technology: A Comprehensive Guide, 76 pages
Electronic Journal Co., Ltd., published Sep. 2011
Original citation (Japanese)
Electronic Journal Archives No. 186
高尾 英邦 （単著）
センサ・CMOS集積化技術★徹底解説, 全76ページ
（株）電子ジャーナル，2011年9月出版
Sensors, Focus on Tactile, Force and Stress Sensors
Contributed section: Chapter-4: Three-Dimensional Silicon Smart Tactile Imager Using Large Deformation of Swollen Diaphragm with Integrated Piezoresistor Pixel Circuits, pp. 53-72
I-Tech Publications Co. LTD., published 2009
Original citation (Japanese)
Sensors, Focus on Tactile, Force and Stress Sensors
H. Takao and M. Ishida（分担執筆）
担当箇所：Chapter-4: Three-Dimensional Silicon Smart Tactile Imager Using Large Deformation of Swollen Diaphragm with Integrated Piezoresistor Pixel Circuits, pp. 53-72
I-Tech Publications Co. LTD., 2009年出版
Next-Generation Sensor Handbook
Contributed section: Chapter 3, Section 3.5, “Next-Generation Sensors for Mechanical Quantities,” pp.127-145
Baifukan Co., Ltd., Jul. 2008
Original citation (Japanese)
次世代センサハンドブック
高尾 英邦（分担執筆）
担当箇所：3章3.5節「次世代機械量センサ」，pp127-145
（株）培風館，2008年7月
Thin Film Handbook (2nd Edition)
Contributed section: Chapter 11, Section 5.3, Integrated Capacitive Sensors (3 pages)
Edited by the JSPS Committee No. 131 on Thin Films, Mar. 2008
Original citation (Japanese)
薄膜ハンドブック（第2版）
高尾 英邦（分担執筆）
担当箇所：第11章5.3 集積化容量型センサ (3ページ)
日本学術振興会 薄膜第131委員会編，2008年3月
MEMS/NEMS Handbook: Techniques and Applications Vol. 2
Contributed section: Chapter-4: Novel MEMS Fluidic Integrated Circuit Technology with ‘MOSFET-Like Microvalve Elements’ , pp. 111-140
Springer USA, published 2006
Original citation (Japanese)
MEMS/NEMS Handbook: Techniques and Applications Vol. 2
H. Takao and M. Ishida （分担執筆）
担当箇所：Chapter-4: Novel MEMS Fluidic Integrated Circuit Technology with ‘MOSFET-Like Microvalve Elements’ , pp. 111-140
Springer USA, 2006年出版
Professional English–Japanese Dictionary: SPED TERRA, Materials and Engineering
Shogakukan, first edition published Jul. 20, 2004
Original citation (Japanese)
プロフェッショナル英和辞典「SPED TERRA 物質・工学編」，
高尾 英邦 （分担執筆）
小学館，2004年7月20日初版発行
SENSORS Update, Vol. 6
Contributed section: Chapter 16: SOI Sensors, pp. 302-331
WILEY-VCH Verlag GmbH, published 2000
Original citation (Japanese)
SENSORS Update, Vol. 6
M. Ishida, Y. Matsumoto, H. Takao （分担執筆）
担当箇所：Chapter 16: SOI Sensors, pp. 302-331
WILEY-VCH Verlag GmbH, 2000年出版
Invited Talks (International)28 entries
Plenary Speech “Quantifying the Sense of Touch: Nano-Tactile MEMS Sensors for Materials, Healthcare, and Tactile AI”
The 7th International Conference on Engineering, Physics, MEMS-Biosensors and Applications (ICEBA2026), HCMUS- University of Science, Ho Chi Minh City, Vietnam, Nov. 2026.
Original citation (Japanese)
Plenary Speech “Quantifying the Sense of Touch: Nano-Tactile MEMS Sensors for Materials, Healthcare, and Tactile AI”
H. Takao (講演予定)
The 7th International Conference on Engineering, Physics, MEMS-Biosensors and Applications (ICEBA2026), HCMUS- University of Science, Ho Chi Minh City, Vietnam, Nov. 2026.
“Bringing Nano-Tactile Intelligence into Practice”
The 12th Asia-Pacific Conference on Transducers and Micro-Nano Technology (APCOT2026), Taichung, Taiwan, Jun. 2026.
Keynote Speech “Nano-Tactile Sensors for Visualization of Texture: Achieving Super-Human Performance via Deep Learning”
2025 IEEE International Conference on Mechatronics and Automation (IEEE ICMA 2025), Beijing Empark Grand Hotel, Beijing, China, Aug. 2025.
Plenary Talk “Visualization of Material Surface Texture in Tactile Sensation”
10th International Conference on Materials Research and Nanotechnology & 11th International Conference on Eco-Sustainable Construction Materials (ICMRN 2024), IBIS Kuala Lumpur City Centre, Kuala Lumpur, Malaysia, Jul. 2024.
“Superhuman Fingertip Sensing Realized by High-Resolution MEMS Tactile Sensors”
The 11th Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2024), National University Singapore, Singapore, Jun. 2024.
“Understanding Tactile-texture Sensation through various Physical Properties; High Resolution Multi-Physics Tactile Sensing and the Device”
2nd International Conference on Physics and its Applications (Physics-2023), Jul. 2023.
Plenary Talk “Ultra-Sensitive Tactile Texture Sensors for Touch”
The Vail Computer Elements Workshop 2022, Vail, USA, Jun. 2022.
“Reproducing Our Sense of Touch Realized by Fingertip-like High Resolution MEMS Tactile Sensors”
The International Conference on Nano Research and Development (ICNRD-2021), Online, Mar. 2021.
Keynote Speech “Reproducing our Fingertip Sensation by Super High Resolution Tactile Sensing”
International Conference & Exhibition on Biosensors & Bioelectronics 2019, Pacific Gateway Hotel at Vancouver Airport, Vancouver, Canada, Oct. 2019.
“Reproducing our Fingertip Sensation by Super High Resolution Tactile Sensing”
European Advance Energy Materials and Technology, M/S Mariella, Stockholm, Sweden, Oct. 2019.
“Touch Feeling Measurement with Novel High Resolution MEMS Tactile Sensors”
The BIT’s 5th Annual World Congress of Smart Materials (WCSM2019), Sheraton Parco de' Medici Rome Hotel, Rome, Italy, Mar. 2019.
“High density tactile information obtained by integrated MEMS tactile sensor array and its processing to discriminate surface textures”
2019 International Conference for Leading and Young Computer Scientists (IC-LYCS 2019), Okinawa Gender Equality Center, Okinawa, Japan, Feb. 2019.
“Ultra-high resolution MEMS tactile sensors for nano-technology”
European Advanced Materials Congress (EAMC2018), Viking Line, Stockholm, Sweeden, Aug. 2018.
“Ultra-High Resolution Tactile Sensing with MEMS Technology”
The 1st JAIST World Conference, JAIST, Ishikawa, Japan, Feb. 2018.
“Novel High Resolution MEMS Tactile Sensors For Measurement of Fingertip Feelings”
International Workshop on Physics of Semiconductor Devices (IWPSD 2017), IIT Delhi, New Delhi, India, Dec. 2017.
“High Resolution Tactile Sensing with Silicon MEMS Sensors for Measurement of Fingertip Sensation”
14th International SoC Design Conference (ISOCC 2017), Grand Hilton Hotel, Seoul, Korea, Nov. 2017.
“Development of high resolution MEMS tactile sensor device and its application”
The Collaborative Conference on Intelligent Systems and Materials 2017, Hotel Campus UAB, Barcelona, Spain, Sep. 2017.
“High Resolution MEMS Tactile Sensors for Realization of Artificial Sense of Fingertip”
2017 International Symposium for Advanced Computing and Information Technology (ISACIT2017), Sun Moon Lake, Taiwan, Aug. 2017.
“High Resolution Silicon MEMS Tactile Sensors for Measurement of Fingertip Sensation”
The 2016 International Meeting for Future of Electron Devices, Ryukoku University, Kyoto, Japan, Jun. 2016.
“Digitizing Our Sense of Touch with Semiconductor Micro Integrated Sensors”
The 3rd Taiwan-Japan Smart Tourism Workshop, Kanonji-Daiich Hotel, Sapporo, Japan, Aug. 2015.
"Silicon Integrated Tactile Sensor Arrays Based on CMOS Compatible MEMS Fabrication Technology"
Proceedings of the 7th ISSS Int. Conf. on Smart Materials Structures and Systems (ISSS 2014), Invited4A (7 pages in USB), Bangalore, India, Jul. 2014.
“Patternable Atmospheric-Pressure Plasma Jet Array Generated by an Integrated Microfluidic Device”
6th International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials (ISPlasma2014), 2 pages in CD-ROM, Meijo University, Nagoya, Japan, Mar. 2014.
“Integrated Silicon MEMS Technology and Novel Functional Sensor Devices”
26th International Microprocesses and Nanotechnology Conference (MNC2013), pp. 8B-8-1 (2pages), Royton Sapporo, Sapporo, Japan, Nov. 2013.
“ASIC for Monitoring of Human Motion”
35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE EMBC2013), Osaka International Convention Center, Osaka Japan, Jul. 2013.
“CMOS-MEMS Integration Technologies and Smart-Microsensors”
Japan-Taiwan CMOS MEMS Workshop 2009, Tsing Hua University, Hsinchu, Taiwan, Mar. 2009.
“High-Performance and Multifunctional Tactile Image Sensors Realized by Silicon CMOS/MEMS Integration Technology”
International Conference on MEMS (ICMEMS 2009), 6pages in CD-ROM, IIT-Madras, Chennai, India, Jan. 2009.
“CMOS/MEMS Technology for Smart, Wireless, and Battery-less Micro Sensing Systems”
Meeting on Embedded Microsystems, IMTEK, University of Freiburg, Germany, Sept. 2007.
“Silicon MEMS Sensors and Devices Harmonized with LSI Technology”
International Workshop on Micro/Nano Science and Engineering for the 21st Century, Ritsumeikan Univ., Shiga, Japan, Oct. 2006.
Invited Talks (Domestic)68 entries
“Nano-Tactile Sensing for Physical AI: Digitizing Texture Information and Its Applications”
Seminar on Applications of Sensing Technology 2026, Osaka Sangyo Sozokan, Jun. 2026
Original citation (Japanese)
“フィジカルAIを拓くナノ触覚センシング － 質感情報のデジタル化とその応用－”
高尾 英邦
センシング技術応用セミナー2026，大阪産業創造館，2026年6月
“Sensing Technology Evolving with Integration: Origins and Developments from the Dawn of Integrated Sensors”
17th Study Meeting on Integrated MEMS Technology, University of Hyogo, May 2026
Original citation (Japanese)
“集積化とともに歩むセンシング技術― 集積センサ黎明期からの系譜と発展 ―”
高尾 英邦
第17回集積化MEMS技術研究会，兵庫県立大学，2026年5月
“What Is ‘Work’? A Scientific Researcher's Perspective”
2025 General Assembly of the Takamatsu City Education Association, Kagawa Prefectural Library, May 2025
Original citation (Japanese)
“「仕事」って何だろう?：ある科学研究者の視点”
高尾 英邦
令和7年度高松市教育会総会，香川県立図書館，2025年5月
“Creating Semiconductor Nano-Tactile Sensors and Sensing Systems That Can Surpass Human Fingertip Sensation”
24th Yamazaki-Teiichi Prize Laureate Lecture, The Japan Academy, Nov. 2024
Original citation (Japanese)
“指先の触感覚を超越可能な半導体ナノ触覚センサと各種センシングシステムの創製”
高尾 英邦
第24回山崎貞一賞 受賞者講演, 日本学士院，2024年11月
“What Can Measuring the Feel of a Surface Reveal?”
Kagawa University Miki Satellite Seminar, Sansan Miki, Oct. 2024
Original citation (Japanese)
“触り心地を測るとそこに何が見えてくるのか？”
高尾 英邦
香川大学三木サテライトセミナー, サンサン三木，2024年10月
“High Resolution Tactile Sensor for Measurement of a Complicated Tactile Feeling of "Shittori" With Moistness”
IEEE EDS Kansai Colloquium, 24th Kansai Colloquium Electron Devices Workshop, Online, Oct. 2024
Original citation (Japanese)
“High Resolution Tactile Sensor for Measurement of a Complicated Tactile Feeling of "Shittori" With Moistness”
高尾 英邦
IEEE EDS 関西コロキアム 第24回「関西コロキアム電子デバイスワークショップ」, Online, 2024年10月
Keynote Lecture “Integration and MEMS Technology: Why Integrate?”
15th JSAP Workshop on Integrated MEMS Technology, Nagoya University, Jul. 2024
Original citation (Japanese)
基調講演 “集積化とMEMS技術：なぜ集積化するのか？”
高尾 英邦
応用物理学会第15回集積化MEMS技術研究ワークショップ, 名古屋大学，2024年7月
“Visualizing the Fingertip Sense of Touch: Silicon MEMS Nano-Tactile Sensors”
MEMS Sensing & Network System Exhibition, TIA-MEMS Seminar and MEMS Training Course, Tokyo Big Sight, Feb. 2024
Original citation (Japanese)
“指先の手触り感を見える化する技術：シリコンMEMSナノ触覚センサ”
高尾 英邦
MEMSセンシング＆ネットワークシステム展「TIA-MEMSセミナー MEMS講習会」, 東京ビックサイト，2024年2月
“High-Resolution Tactile Sensing Beyond the Fingertip and Visualization of Softness Distributions”
Technical Information Seminar on Mechanisms and Quantification of Softness and Hardness Perception, Online, Jul. 2023
Original citation (Japanese)
“高分解能触覚センシングで実現する指先以上の感覚と柔らかさ分布の可視化”
高尾 英邦
技術情報会「柔らかさ、硬さ」を感じるメカニズムと定量化技術セミナー, Online, 2023年7月
“High-Resolution Tactile Sensors That Reproduce Delicate Fingertip Sensations and Their Life Science Applications”
Osaka Chamber of Commerce and Industry, Forum for the Commercialization of Next-Generation Medical Systems, Online, Oct. 2022
Original citation (Japanese)
“指先の繊細な感覚を再現する高解像度触覚センサとライフサイエンスへの応用”
高尾 英邦
大阪商工会議所 次世代医療システム産業化フォーラム, Online, 2022年10月
“New Tactile Experiences and Value from Measuring Subtle Textures: Superhuman Touch Through AI and High-Performance Sensing”
Japan Techno Center Seminar on Tactile Texture Sensing Technology and Its Applications, Online, Aug. 2022
Original citation (Japanese)
“繊細な「テクスチャ」の計測が生み出す新しい触覚と価値、人工知能と高性能センシングの協働による「超触覚」の実現”
高尾 英邦
日本テクノセンター触覚の質感センシング技術とその応用セミナー，Online, 2022年8月
“Silicon Integrated MEMS Technology and Its Extension to Tactile Sensing”
20th Intensive Course on MEMS, Tohoku University Micro System Integration Center, Sunport Takamatsu, Aug. 2022
Original citation (Japanese)
“シリコン集積化MEMS技術と触覚センシングへの展開”
高尾 英邦
東北大学マイクロシステム融合研究開発センター第20回MEMS集中講義, サンポート高松，2022年8月
“Developing Interdisciplinary Research with Microstructured Sensors”
Joint Meeting of the 6th Chugoku–Shikoku Regional Meeting of the Japanese Society of Clinical Pharmacology and Therapeutics and the 6th Kuroshio Conference: Encouraging Emergent Research, Kagawa University, Jul. 2022
Original citation (Japanese)
“微細構造センサを用いた異分野融合研究の展開”
高尾 英邦
第6回日本臨床薬理学会中国・四国地方会、第6回黒潮カンファレンス合同学会 ―創発研究のススメ―, 香川大学，2022年7月
“Silicon Nano-Tactile Sensors”
9th Meeting of JSPS R025 Committee on Advanced Thin-Film Interface Function Creation, Online, Jun. 2022
Original citation (Japanese)
“シリコン製ナノ触覚センサ”
高尾 英邦
日本学術振興会 R025 先進薄膜界面機能創成委員会 第9回研究会, Online, 2022年6月
“MEMS-Based ‘Touch Feeling Scanner’ for Quantitative Evaluation of Fingertip Sensation”
IEEE EDS 21st Kansai Colloquium Electron Devices Workshop, Online, Sep. 2021
Original citation (Japanese)
“MEMS-Based ‘Touch Feeling Scanner’ for Quantitative Evaluation of Fingertip Sensation”
Y. Nishida, K. Watatani, K. Terao, F. Shimokawa, K. Arimoto, H. Takao
IEEE EDS第21回「関西コロキアム電子デバイスワークショップ」, Online, 2021年9月
“Integrated Nano-Tactile Sensors That Visualize Delicate Fingertip Sensations”
82nd JSAP Autumn Meeting, Symposium on Sensor Integration Technologies for Sensor Fusion, Online, Sep. 2021
Original citation (Japanese)
“繊細な指先の感覚を可視化する集積化ナノ触覚センサ”
高尾 英邦
第82回応用物理学会秋季学術講演会 センサ融合に向けたセンサ集積技術シンポジウム, Online, 2021年9月
“What Future Can Numerical and Information Analysis Create? The Example of Sensors”
Kagawa Regional Revitalization Lecture Series, Takamatsu Nishi High School, May 2019
Original citation (Japanese)
“数値・情報解析はどんな未来につながるのか：センサーの例”
高尾 英邦
かがわ創生講座, 高松西高等学校，2019年5月
“Tactile Information Processing Technologies for Quantifying the Sense of Touch with Tactile Sensors”
Technical Information Institute Seminar on Tactile Perception Mechanisms, Characteristics, Quantitative Evaluation, and Reproduction, Technical Information Institute, Apr. 2019
Original citation (Japanese)
“触覚センサによる手触り感数値化の実現に向けた触覚情報処理基盤技術”
高尾 英邦
技術情報協会触感の知覚メカニズム、特性と定量評価、再現技術セミナー, 技術情報協会，2019年4月
“Nano-Tactile Sensing Technology for Capturing Subtle Surface Feel”
8th EIRIS Intelligent Sensors and MEMS Workshop, Kansei × Sensors: Where Kansei Engineering Meets Electronics, Hotel Associa Toyohashi, Feb. 2019
Original citation (Japanese)
“繊細な手触り感を取得するナノ触覚センシング技術”
高尾 英邦
第８回EIRISインテリジェントセンサ・MEMS研究会 「感性×センサ -感性工学とエレクトロニクスの出会い-」，ホテルアソシア豊橋，2019年2月
“High-Resolution Tactile Sensing with Silicon Integrated MEMS Technology”
65th JSAP Spring Meeting, Waseda University, Mar. 2018
Original citation (Japanese)
“シリコン集積化 MEMS 技術による高解像度触覚センシング”
高尾 英邦
第65回応用物理学会春季学術講演会, 早稲田大学，2018年3月
“Developing Nano-Tactile Sensors Using DRIE and Realizing Surface-Feel Measurement”
Osaka Research Institute of Industrial Science and Technology Seminar on Using Deep Reactive Ion Etching (DRIE) Equipment for MEMS, MyDome Osaka, Jan. 2018
Original citation (Japanese)
“DRIEを用いたナノ触覚センサの開発と手触り計測技術の実現”
高尾 英邦
大阪産業技術研究所 MEMS用シリコン深堀り(DRIE）装置活用セミナー, マイドームおおさか，2018年1月
“Cell-like Sensor Technology for Measuring Skin Sensations in Medical Applications”
2nd Kuroshio Conference, Kochi Prefectural Culture Hall, Oct. 2017
Original citation (Japanese)
“医療での皮膚感覚計測応用を目指した「細胞化センサ」技術”
高尾 英邦
第2回黒潮カンファレンス, 高知県民文化ホール，2017年10月
“Quantitative Evaluation, Measurement, and Analysis of Surface Feel”
Technical Information Institute Seminar on Quantitative Evaluation, Measurement, and Analysis of Surface Feel, Technical Information Institute, Oct. 2017
Original citation (Japanese)
“触り心地の定量評価と測定・解析技術”
高尾 英邦
技術情報協会 触り心地の定量評価と測定・解析技術セミナー, 技術情報協会，2017年10月
“Sensing Devices for Measuring Human Sensations”
IEEJ Electronics, Information and Systems Society Conference, Sunport Takamatsu, Sep. 2017
Original citation (Japanese)
“人間の感覚計測に向けたセンシングデバイス”
高尾 英邦
電気学会 電子情報システム部門大会, サンポート高松，2017年9月
“High-Definition Tactile Sensors for Evaluating Fingertip Surface Feel and Their Application to Man-Made Fiber Development”
66th Chugoku–Shikoku Industry–Academia Chemistry Forum, Kagawa University, Aug. 2017
Original citation (Japanese)
“指先の手触り感評価に向けた高精細触覚センサと化学繊維開発への応用”
高尾 英邦
第66回中国四国産学連携化学フォーラム, 香川大学，2017年8月
“Developing Functionally Integrated MEMS Microsensors with Integrated Circuit Processes”
Cat-CVD Study Meeting, Rihga Hotel Zest Takamatsu, Jul. 2017
Original citation (Japanese)
“集積回路プロセスによる機能集積型MEMSマイクロセンサの開発”
高尾 英邦
Cat-CVD研究会, リーガゼストホテル高松，2017年7月
“Extending Ultrahigh-Resolution Tactile Sensors to Surface-Feel Measurement”
Technical Information Institute Seminar on High-Sensitivity Tactile Sensing and Applications, Technical Information Institute, Apr. 2017
Original citation (Japanese)
“超高解像度触覚センサによる手触り感計測技術への展開”
高尾 英邦
技術情報協会触覚センサの高感度センシングと応用技術セミナー, 技術情報協会，2017年4月
“Developing Nano-Tactile Sensing Technology and Its Prospects for Soft Materials”
Chemical Society of Japan Chugoku–Shikoku Regional Meeting, Kagawa University, Nov. 2016
Original citation (Japanese)
“ナノ触覚センシング技術の開発とソフトマテリアルへの期待”
高尾 英邦
日本化学会中国四国大会, 香川大学，2016年11月
“Developing Cell-like Sensors for New Fields of Sensing”
2016 IEICE Society Conference, Hokkaido University, Sep. 2016
Original citation (Japanese)
“センシングの新分野を指向する「細胞化センサ」の開発”
高尾 英邦
2016年電子情報通信学会ソサイエティ大会, 北海道大学，2016年9月
“Developing Nano-Tactile Devices for Detecting Subtle Touch and Their Potential Application to Bone Metastases from Prostate Cancer”
15th KMU Urology Seminar, Takamatsu Kokusai Hotel, Feb. 2016
Original citation (Japanese)
“繊細な触覚を検知できるナノ触覚デバイスの開発と前立腺癌骨転移への応用の可能性”
高尾 英邦
第15回KMU泌尿器科セミナー, 高松国際ホテル，2016年2月
“Creating Fingertip Skin Sensations in Silicon: Development and Applications of Integrated Silicon Tactile Sensors”
13th JEITA Intelligent Sensing Technology Subcommittee Meeting, Japan Electronics and Information Technology Industries Association, Jan. 2016
Original citation (Japanese)
“シリコンで創る指先皮膚感覚：集積化シリコン触覚センサの開発と応用”
高尾 英邦
電子情報技術産業協会第13回知的センシング技術分科会, 電子情報技術産業協会，2016年1月
“Frontiers in Microsensors That Perceive Change Like Humans: The Future of Sensors in Everyday Life”
Embedded Technology West2015, Kansai Embedded Technology Exhibition, Technical Session, Grand Front Osaka, Jun. 2015
Original citation (Japanese)
“人間のように変化を感じるマイクロセンサ技術の最前線 ：日常生活に染み込むセンサー技術の将来を予測”
高尾 英邦
Embedded Technology West2015 組込み総合技術展 関西 テクニカルセッション, グランフロント大阪，2015年6月
“Creating Devices with New Functions Through Integrated Silicon MEMS Technology”
2013 Autumn Meeting of the Japan Society for Precision Engineering, Kansai University, Senriyama Campus, Sep. 2013
Original citation (Japanese)
“集積化シリコンMEMS技術による新機能デバイスの創出”
高尾 英邦 Keynote Speech
精密工学会２０１３年度秋季大会，関西大学 千里山キャンパス，2013年9月
“Advances in Microsensors: Capabilities and Possibilities of Diverse Sensor Technologies Approaching Human Sensation”
Kansai Embedded Technology Exhibition, Embedded Technology West2013, Technical Session, INTEX Osaka, Jun. 2013
Original citation (Japanese)
“最新マイクロセンサー技術「人間の感覚に迫る多様なセンサー技術で何ができ、どんな可能性が開けるのか」”
高尾 英邦
組み込み総合技術展関西 Embedded Technology West2013 テクニカルセッション，インテックス大阪，2013年6月
“Integrated Skin Tactile Sensors Using MEMS: Development, Trends, Applications to Nursing-Care and Welfare-Support Robots and Devices, and Future Directions”
Japan Technical Information Center Seminar on Next-Generation Tactile Sensors for Nursing-Care and Welfare-Support Robots and Devices: Development, Trends, Applications, and Future Directions, Media Box, May 2013
Original citation (Japanese)
“MEMS技術を用いた集積化皮膚触覚センサの開発・技術動向と介護・福祉支援ロボット/機器への応用及び今後の展開”
高尾 英邦
日本技術情報センターセミナー介護・福祉支援ロボット/機器用次世代触覚センサの開発・技術動向と応用例及び今後の展開，メディアボックス，2013年5月
“Integrated Circuit Systems: Human Sensing IC”
9th Microsystems Integration Workshop, Health and MEMS, Tohoku University, Jan. 2013
Original citation (Japanese)
“集積回路システム-Human Sensing IC-”
高尾 英邦
マイクロシステム融合研究会（第九回）「健康とMEMS」，東北大学，2013年1月
“Do Androids Dream of Tomorrow's Sensor Technology?”
JSAP Informal Meeting, Future Devices Forum, Ehime University, Sep. 2012
Original citation (Japanese)
“アンドロイドは明日のセンサ技術に夢を見るか？”
高尾 英邦
応用物理学会インフォーマルミーティング「未来デバイス懇話会」，愛媛大学，2012年9月
“Integrated Silicon MEMS Technology and Its Applications to Creating New Functions”
Special Lecture, 30th Laser Sensing Symposium, Olivian Shodoshima, Sep. 2012
Original citation (Japanese)
“新機能創出にむけた集積化シリコンMEMS技術とその応用”
高尾 英邦，大平 文和
第30回レーザーセンシングシンポジウム 特別講演，オリビアン小豆島，2012年9月
Keynote Lecture “MEMS/CMOS Integration: Past, Present, and Future—The Evolution of Device and Design Technologies”
Design Gaia 2011: A New Frontier in VLSI Design, New Welcity Miyazaki, Nov. 2011
Original citation (Japanese)
基調講演 “MEMS/CMOS集積化技術の過去・現在・未来～ デバイス技術と設計技術の変遷 ～”
高尾 英邦
デザインガイア2011 -VLSI設計の新しい大地-，ニューウェルシティ宮崎，2011年11月
“Prospects and Challenges for Heterogeneous Integration from the Perspectives of LSI and High-Density Packaging”
Panel Session, Design Gaia 2011: A New Frontier in VLSI Design, New Welcity Miyazaki, Nov. 2011
Original citation (Japanese)
“LSIと高密度実装技術から見た異種機能集積技術への期待と課題”
高尾 英邦 パネル講演
デザインガイア2011 -VLSI設計の新しい大地-パネルセッション講演，ニューウェルシティ宮崎，2011年11月
“Integrated Sensor Arrays and Other Topics”
Transducers’11 Review Meeting, organized by the MEMS Technology Subcommittee, University of Hyogo, Jul. 2011
Original citation (Japanese)
“集積化アレイセンサ関連・その他”
高尾 英邦
MEMS技術分科会主催Transducers’11報告会，兵庫県立大学，2011年7月
“A Comprehensive Guide to Sensor–CMOS Integration Technology”
Electronic Journal 841st Technical Seminar, Sohyo Kaikan, Jul. 2011
Original citation (Japanese)
“センサ・CMOS集積化技術徹底解説”
高尾 英邦
Electronic Journal 第841回 Technical Seminar，総評会館，2011年7月
“Does Sensor Technology Dream of Tomorrow's Machines?”
2nd Intellectual Cafe, AIST Shikoku Center, May 2011
Original citation (Japanese)
“センサ技術は明日の機械の夢を見るか？”
高尾 英邦
第二回インテレクチュアル・カフェ ，産業技術総合研究所四国センター，2011年5月
“Integrated Sensor Technology and Practical Applications: Circuit and Integration Design to Realize Its Potential”
Nikkei Electronics NE Academy, Biz Shinjuku, Apr. 2011
Original citation (Japanese)
“集積化センサ技術とその実用例－そのポテンシャルを活かす回路と集積化の勘所”
高尾 英邦
日経エレクトロニクスNEアカデミー，Biz新宿, 2011年4月
“CMOS-Integrated MEMS Technology in the Nano Era: Current Status and Prospects”
Workshop on Heterogeneous Component Integration, organized by the Technical Committee on Next-Generation Nanotechnology, Faculty of Science and Engineering, Waseda University, Jan. 2011
Original citation (Japanese)
“ナノ時代におけるCMOS集積化MEMS技術の現状と展望”
高尾英邦
次世代ナノ技術に関する研究専門委員会主催研究会「異種要素の集積化技術」，早稲田大学理工学術院，2011年1月
“MEMS/CMOS Design Technology for Heterogeneous Integration”
Symposium at the 71st JSAP Annual Meeting, Nagasaki University, Gofuku Campus, Sep. 2010
Original citation (Japanese)
“異種機能集積化におけるMEMS/CMOS設計技術”
高尾 英邦
第71回応用物理学会学術講演会シンポジウム，長崎大学 五福キャンパス，2010年9月
“The Potential of CMOS/MEMS Technology and Its Application to Functionally Integrated Tactile Sensors”
7th Microsystems Applications Workshop, JST Innovation Plaza Tokai, Oct. 2010
Original citation (Japanese)
“CMOS/MEMS技術の可能性と機能集積化触覚センサへの応用”
高尾 英邦
第7回マイクロシステム応用研究会，JSTイノベーションプラザ東海, 2010年10月
“Integrated Sensor Technology: Circuit and Integration Design to Realize Its Potential”
Nikkei Electronics NE Academy, Biz Shinjuku, Sep. 2010
Original citation (Japanese)
“集積化センサ技術～そのポテンシャルを活かす回路と集積化の勘所～”
高尾 英邦
日経エレクトロニクスNEアカデミー，Biz新宿, 2010年9月
“Developing a Silicon Integrated Tactile Imager to Surpass Human Skin Sensation”
2010 IEICE General Conference, Tutorial Session on Information Processing for the Five Senses: Application Prospects, Tohoku University, Kawauchi Campus, Mar. 2010
Original citation (Japanese)
“皮膚感覚の超越をめざすシリコン集積化触覚イメージャーの開発”
高尾 英邦
2010年電子情報通信学会総合大会チュートリアルセッション「「五感」情報処理： アプリケーションの展望」，東北大学 川内キャンパス，2010年3月
“Ubiquitous Integrated Microsensor Technology for a Safe and Secure Society”
2010 IEICE General Conference, Tutorial Session on Safe and Secure Living: Challenges for Communication Networks, Circuits, and Systems, Tohoku University, Kawauchi Campus, Mar. 2010
Original citation (Japanese)
“社会の安全・安心にむけたユビキタス集積化マイクロセンサ技術”
高尾 英邦，石田 誠，澤田 和明，Jong-Wan Kim，Wan-Hoon Lee
2010年電子情報通信学会総合大会チュートリアルセッション「安全・安心な生活のために：情報通信ネットワーク・回路・システム技術の挑戦」，東北大学川内キャンパス，2010年3月
“Integration of LSI and MEMS Sensors: Technologies and Prospects”
2009 IEICE Society Conference, Tutorial Session on MEMS-Integrated LSI Technology for More than Moore, Niigata University, Sep. 2009
Original citation (Japanese)
“LSIとMEMSセンサの集積化技術と展望”
高尾 英邦
平成21年電子情報通信学会ソサイエティー大会チュートリアルセッション「More than Mooreを実現するMEMS融合LSI技術」，新潟大学，2009年9月
“Integrating MEMS, Sensors, and Integrated Circuits”
56th JSAP Spring Meeting, Symposium on Advanced Developments in Integrated MEMS Technology Toward Commercialization, University of Tsukuba, Mar. 2009
Original citation (Japanese)
“ＭＥＭＳ・センサと集積回路の統合化技術”
高尾 英邦，石田 誠
第５６回応用物理学関係連合講演会シンポジウム「産業化に向かう集積化ＭＥＭＳ技術の先端開発動向」, 筑波大学，2009年3月
“Distributed Smart Sensors Enabled by Functional Integration”
Symposium at the 2009 IEEJ National Convention, Hokkaido University, Mar. 2009
Original citation (Japanese)
“機能集積化で実現する分散型スマートセンサ”
高尾 英邦，澤田 和明，石田 誠
平成21年電気学会全国大会シンポジウム，北海道大学，2009年3月
“Intelligent Sensor Technology and Its Future”
292nd Meeting of the Higashi-Mikawa Industry–Academia Exchange Salon, Hotel Arc Riche Toyohashi, Feb. 2009
Original citation (Japanese)
“インテリジェントセンサ技術と未来像”
高尾 英邦
東三河産学交流サロン第292回例会，ホテルアークリッシュ豊橋，2009年2月
“Toward More than Moore: Multifunctional Sensing Systems Through CMOS/MEMS Integration”
Osaka University Global COE Mini-Seminar, Osaka University, Suita Campus, Nov. 2008
Original citation (Japanese)
“More than Mooreへの潮流：CMOS/MEMS集積化機能融合センシングシステム”
高尾 英邦
大阪大学 グローバルCOEミニセミナー，大阪大学吹田キャンパス，2008年11月
“Sensor Technology and Its Applications: A Comprehensive Guide—Keynote Lecture”
Electronic Journal 229th Technical Seminar, Sohyo Kaikan, Sep. 2008
Original citation (Japanese)
“センサ技術とその応用 徹底解説：基調講演”
高尾 英邦
Electronic Journal 第229回 Technical Seminar，総評会館，2008年9月
“Developing Functionally Integrated Microdevices by Combining Micromachines and Electronic Circuits”
Micromachine Technology Exchange Group Workshop, Kagawa University, Mar. 2008
Original citation (Japanese)
“微小機械と電子回路の融合による機能集積型マイクロデバイスの開発”
高尾 英邦
マイクロマシーン技術交流グループ研究会，香川大学，2008年3月
“SOI Technology for Ultrahigh-Temperature MEMS Sensors and Integrated Circuits, and Sensor Applications”
Technical Review Seminar on Technologies Required for Next-Generation High-Performance MEMS Sensors, University of Hyogo, Jan. 2008
Original citation (Japanese)
“超高温用ＭＥＭＳ センサ・集積回路にむけたＳＯＩ技術とセンサ応用”
高尾 英邦
次世代の高性能MEMSセンサに必要な技術調査講演会，兵庫県立大学，2008年1月
“Integrating Microelectronics and Mechanics: CMOS/MEMS Sensors and Systems”
Osaka University Global COE Mini-Seminar, Osaka University, Suita Campus, Dec. 2007
Original citation (Japanese)
“マイクロエレクトロニクスとメカニクスの融合：CMOS/MEMSセンサとシステム”
高尾 英邦
大阪大学 グローバルCOEミニセミナー，大阪大学吹田キャンパス，2007年12月
“A Silicon Tactile Image Sensor Combining Flexibility with High Spatial Resolution”
Tokai Manufacturing Revitalization Council, 2nd Technology Seeds Presentation of Fiscal 2007, Nagoya, Sep. 2007
Original citation (Japanese)
“柔軟性と高位置分解能を両立するシリコン触覚イメージセンサ”
高尾 英邦
東海ものづくり創生協議会平成１９年度第２回技術シーズ発表会，名古屋，2007年9月
“MEMS Systems”
Japan Society of Mechanical Engineers Transducers’07 Review Meeting, Campus Plaza Kyoto, Aug. 2007
Original citation (Japanese)
“MEMSシステム”
高尾 英邦
日本機械学会Transducers’07報告会，キャンパスプラザ京都，2007年8月
“Sensor Technology in Automotive Electronics”
11th Analog VLSI Symposium, organized by the IEEJ Technical Committee on Electronic Circuits, Tokyo Institute of Technology, Ookayama Campus, Apr. 2007
Original citation (Japanese)
“カーエレクトロニクス分野におけるセンサ技術”
高尾英邦
第11回 アナログVLSIシンポジウム, （社）電気学会 電子回路研究会主催, 東京工業大学 大岡山キャンパス 2007年4月
“Silicon Smart Microsensors Using CMOS/MEMS Technology”
2006 International Meeting for Future of Electron Devices Kansai (2006IMFEDK), organized by IEEE EDS Kansai, Kyoto University, Yoshida Campus, Apr. 2006
Original citation (Japanese)
“CMOS/MEMS技術を用いたシリコンスマートマイクロセンサ”
高尾 英邦
2006 International Meeting for Future of Electron Devices Kansai (2006IMFEDK), IEEE EDS Kansai主催，京都大学 吉田キャンパス, 2006年4月
“The Current State and Challenges of MEMS: Integrating Electronic Circuits and Micromachines”
10th Analog VLSI Symposium, organized by the IEEJ Technical Committee on Electronic Circuits, Tokyo Institute of Technology, Ookayama Campus, Apr. 2006
Original citation (Japanese)
“「MEMS分野における現状と課題」電子回路と微小機械融合の観点から”
高尾 英邦
第10回 アナログVLSIシンポジウム, （社）電気学会 電子回路研究会主催, 東京工業大学 大岡山キャンパス，2006年4月
“Smart Microsensors Using Silicon MEMS Technology”
14th Sensor Techno School, Next-Generation Sensors and Actuators: From Fundamentals to Advanced Technologies, organized by the Next Generation Sensor Association, Chemistry Hall, Oct. 2005
Original citation (Japanese)
“シリコンMEMS技術を用いたスマートマイクロセンサ”
高尾 英邦
第14回センサテクノスクール「次世代センサ・アクチュエータの基礎から最先端技術」, 次世代センサ協議会主催, 化学会館，2005年10月
“SOI-CMOS Integrated Circuits and Microsensor Systems for High-Temperature Environments”
18th Fall Meeting of the Ceramic Society of Japan, Osaka Prefecture University, Sep. 2005
Original citation (Japanese)
“高温環境に耐えるSOI-CMOS集積回路とマイクロセンサシステム”
高尾 英邦，石田 誠
日本セラミック協会第18回秋期シンポジウム, 大阪府立大学，2005年9月
“Silicon Smart Microsensors Through MEMS–CMOS Integration”
July Meeting of the IEICE Technical Committee on Integrated Circuits and Devices, Toyohashi University of Technology, Jul. 2005
Original citation (Japanese)
“MEMS-CMOS集積化技術によるシリコンスマートマイクロセンサ”
高尾 英邦，澤田 和明，石田 誠
電子情報通信学会集積回路研究会７月研究会, 豊橋技術科学大学， 2005年7月
“Sensor and Circuit System Integration on Silicon Microchips”
Symposium at the 2003 IEEJ National Convention, Tohoku Gakuin University, Mar. 2003
Original citation (Japanese)
“シリコンマイクロチップ上へのセンサ・回路システム集積化技術”
高尾 英邦，澤田 和明，石田 誠
平成15年電気学会全国大会シンポジウム，東北学院大学，2003年3月
Reviews3 entries
“Nano-Tactile Sensors That Visualize Delicate Fingertip Sensations: Frontiers in Quantifying the Sense of Touch”
Tribologist, Vol. 69, No. 8, pp. 559-564, DOI: 10.18914/tribologist.69.08_559, Aug. 2024.
Original citation (Japanese)
“繊細な指先の感覚を可視化する『ナノ触覚センサ』 -手触り感の領域を数値化可能な触覚センシングのフロンティア-”
高尾 英邦
トライボロジスト, Vol. 69, No. 8, pp. 559-564, DOI: 10.18914/tribologist.69.08_559, 2024年8月.
“A Silicon Integrated Tactile Imager Aimed at Surpassing Human Skin Sensation”
The Journal of the Institute of Electronics, Information and Communication Engineers, Vol. 94, No.6, pp.470-474, Jun. 2011.
Original citation (Japanese)
“皮膚感覚の超越をめざすシリコン集積化触覚イメージャー”
高尾 英邦
電子情報通信学会誌 , Vol. 94, No.6, pp.470-474, 2011年6月.
“Recent Advances and Applications of MEMS Technology: Planar Sensors for Blood Cell Counting”
Denshi Zairyo (Electronic Materials), Vol. 41, No. 5, pp. 40-43, May 2002.
Original citation (Japanese)
“MEMSの最新技術動向と応用展開：血球計数用平面状センサへの応用”
衣斐 寛之，佐竹 大輔，高尾 英邦，石田 誠
電子材料，第41巻，第5号，pp. 40-43，2002年5月.