“Evaluation of Multi-Electrode Effects on Electrovibration Tactile Stimulation”
Transactions of The Japan Institute of Electronics Packaging, Vol. 10, pp. E17-004-1-E17-004-8, 2017.
PUBLICATIONS
高尾英邦の2017年の論文・著書・講演等を掲載しています。
Transactions of The Japan Institute of Electronics Packaging, Vol. 10, pp. E17-004-1-E17-004-8, 2017.
電気学会論文誌 E(センサ・マイクロマシン部門誌), Vol. 137, No. 5, pp. 128-133, May 2017.
Japanese Journal of Applied Physics, Vol. 56, No. 4S, pp. 04CF09-1~6, 2017.
Proceedings of the 2nd Int. Conf. on Intelligent Informatics and BioMedical Sciences (ICIIBMS 2017), pp. 163–164, Okinawa, Japan, Nov. 2017.
Proceedings - International SoC Design Conference 2017 (ISOCC 2017), pp. 17-18, Seoul, Korea, Nov. 2017.
Proceedings of the 21st Int. Conf. on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2017), pp. 433–434, Savannah, Georgia, USA, Nov. 2017.
Proceedings of the 30th IEEE Sensors Conf. (IEEE Sensors 2017), pp. 1–3, Glasgow, UK, Oct. 2017.
Proceedings of the 2017 Int. Conf. on Solid State Devices and Materials (SSDM 2017), pp. 371–372, Sendai, Japan, Sep. 2017.
Proceedings of the 2017 IEEE World Haptics Conf. (WHC 2017), pp. 659–664, Munich, Germany, Jul. 2017.
Digest of Technical Papers of 19th International Conference on Solid‑State Sensors, Actuators and Microsystems (Transducers 2017), pp. 1364–1367, Kaohsiung, Taiwan, Jun. 2017.
Digest of Technical Papers of 19th International Conference on Solid‑State Sensors, Actuators and Microsystems (Transducers 2017), pp. 1604–1607, Kaohsiung, Taiwan, Jun. 2017.
Proceedings of 2017 International Conference on Electronics Packaging (ICEP 2017), pp. 484-486, Yamagata, Apr. 2017.
Proceedings of the 30th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2017), pp. 223–226, Las Vegas, USA, Jan. 2017.
Proceedings of the 30th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2017), pp. 585–588, Las Vegas, USA, Jan. 2017.
Proceedings of the 30th IEEE Int. Conf. on Micro Electro Mechanical Systems (IEEE MEMS 2017), pp. 577–580, Las Vegas, USA, Jan. 2017.
担当箇所:第4章第3節[3] 「柔軟な素材表面を高精度で測定するMEMS 触覚センサ」,pp.436-445
サイエンス&テクノロジー(株),2017年11月出版
International Workshop on Physics of Semiconductor Devices (IWPSD 2017), IIT Delhi, New Delhi, India, Dec. 2017.
14th International SoC Design Conference (ISOCC 2017), Grand Hilton Hotel, Seoul, Korea, Nov. 2017.
The Collaborative Conference on Intelligent Systems and Materials 2017, Hotel Campus UAB, Barcelona, Spain, Sep. 2017.
2017 International Symposium for Advanced Computing and Information Technology (ISACIT2017), Sun Moon Lake, Taiwan, Aug. 2017.
第2回黒潮カンファレンス, 高知県民文化ホール,2017年10月
技術情報協会 触り心地の定量評価と測定・解析技術セミナー, 技術情報協会,2017年10月
電気学会 電子情報システム部門大会, サンポート高松,2017年9月
第66回中国四国産学連携化学フォーラム, 香川大学,2017年8月
Cat-CVD研究会, リーガゼストホテル高松,2017年7月
技術情報協会触覚センサの高感度センシングと応用技術セミナー, 技術情報協会,2017年4月